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Substrate and semiconductor device package and method for manufacturing the same

一种封装装置、半导体的技术，应用在半导体/固态器件制造、半导体器件、半导体/固态器件零部件等方向，能够解决阻碍发展、巨大成本等问题

Pending Publication Date: 2021-10-22
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the huge cost of this type of packaging technology is the main problem hindering its development

Method used

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  • Substrate and semiconductor device package and method for manufacturing the same
  • Substrate and semiconductor device package and method for manufacturing the same
  • Substrate and semiconductor device package and method for manufacturing the same

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Embodiment Construction

[0048] Common reference numbers are used throughout the drawings and detailed description to refer to the same or similar components. Embodiments of the present disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings.

[0049] The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify certain aspects of the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description, the formation of a first feature over or on a second feature may include embodiments in which the first feature and the second feature are formed or disposed in direct contact, and may also include embodiments in which additional features may be formed on the first feature. An embodiment in which a featur...

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PUM

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Abstract

A substrate, a semiconductor package device and a method of manufacturing a semiconductor device package are provided. The substrate includes a low density wiring structure, a first middle density wiring structure and high density wiring structure. The first middle density wiring structure is electrically connected to the low density wiring structure. The high density wiring structure is electrically connected to the low density wiring structure. The high density wiring structure and the first middle density wiring structure are disposed side by side. A line space of a circuit layer of the low density wiring structure is greater than a line space of a circuit layer of the first middle density wiring structure. The line space of the circuit layer of the first middle density wiring structure is greater than a line space of a circuit layer of the high density wiring structure.

Description

technical field [0001] The present disclosure relates to a substrate, a semiconductor package device, and a method for manufacturing the substrate, a semiconductor package device, and to a substrate including a wiring structure, and a method for manufacturing the substrate. Background technique [0002] As semiconductor process technology for wafers continues to advance, the semiconductor devices resulting from the technology can carry more signals and operate at higher bandwidths. At the same time, several new packaging technologies are being implemented in these advanced semiconductor devices. For example, one of the advanced semiconductor devices may be electrically connected to the package substrate through a silicon interposer structure. In addition, an advanced semiconductor device may be electrically connected to another advanced semiconductor device through an embedded bridge die. However, the huge cost of this type of packaging technology is the main problem hinde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L23/31H01L21/56
CPCH01L23/49816H01L23/49822H01L23/49827H01L23/49838H01L23/3128H01L21/561H01L23/5386H01L23/5389H01L23/5385H01L23/5383H01L25/0655H01L25/18H01L25/50H01L2224/16227H01L2224/16235H01L2924/15313H01L21/486H01L21/50H01L23/5384
Inventor 胡逸群唐心陆
Owner ADVANCED SEMICON ENG INC