Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for measuring resistance value of circuit board inner layer buried resistor pattern

A circuit board, resistance value technology, applied in the direction of measuring resistance/reactance/impedance, measuring electricity, measuring electrical variables, etc., can solve the problems of resistance value change, loss increase, failure to detect resistance value, etc., to reduce losses and save cost, avoid the effect of scrapping together

Pending Publication Date: 2021-10-26
HUIZHOU KING BROTHER CIRCUIT TECH
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, after lamination, the resistance pattern is embedded in the PCB board. This process needs to be treated with browning potion, and the press is laminated in a high-temperature and high-pressure environment. The resistance material will change due to chemical reactions, which cannot be detected. Resistor value inside the board
The performance test can only be performed on the client side after assembling the finished product. When the resistance value changes beyond the customer’s tolerance requirements, the buried resistance PCB board and the assembled components will be scrapped together, and the loss will double.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for measuring resistance value of circuit board inner layer buried resistor pattern

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] S1. Copy the buried resistance pattern in the unit to the edge of the board to form a buried resistance pattern on the side of the board; set the buried resistance pattern on the side of the board according to the resistance value of the buried resistance, the width of the buried resistance pattern on the side of the board remains unchanged, and the length is set according to the preset ratio;

[0042] S2. Set copper wires and test patterns at both ends of the embedded resistance pattern on the edge of the board to form a test strip; the copper wires are arranged at both ends of the embedded resistance pattern on the edge of the board, and the test pattern is arranged at both ends of the copper wire;

[0043] S3. Empty the surface copper at the position of the test strip on the edge of the board to be hollowed out at other levels; expose the test strip;

[0044] S4. Drill through holes at the position of the test pattern on the board and metallize the holes;

[0045] S5...

Embodiment 2

[0049] S1. Copy the buried resistance pattern in the unit to the edge of the board to form a buried resistance pattern on the side of the board; set the buried resistance pattern on the side of the board according to the resistance value of the buried resistance, the width of the buried resistance pattern on the side of the board remains unchanged, and the length is set according to the preset ratio;

[0050] S2. Set copper wires and test patterns at both ends of the embedded resistance pattern on the edge of the board to form a test strip; the copper wires are arranged at both ends of the embedded resistance pattern on the edge of the board, and the test pattern is arranged at both ends of the copper wire;

[0051] S3. Empty the surface copper at the position of the test strip on the edge of the board to be hollowed out at other levels; expose the test strip;

[0052] S4. Drill through holes at the position of the test pattern on the board and metallize the holes;

[0053] S5...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for measuring the resistance value of a circuit board inner layer buried resistor pattern, and the method comprises the steps: S1, copying a resistor pattern, and copying an in-unit buried resistor pattern to a board edge to form a board edge buried resistor pattern; S2, arranging a test strip: arranging copper wires and test patterns at two ends of the board edge buried resistor pattern to form the test strip; S3, hollowing out a copper layer, namely hollowing out surface copper of other layers at the position of the board edge test strip; S4, adding a via hole, drilling a through hole in the position of the test pattern on the board surface, and electroplating hole metal; and S5, designing a hole ring, and arranging the hole ring on the through hole plate surface to be communicated with the test pattern. Therefore, the actual resistance value of the embedded resistor pattern in the unit can be obtained by testing the outer-layer hole ring, the method is simple and convenient, the requirement of a customer on the resistance value is ensured to be met, the embedded resistor PCB and an assembly device are prevented from being scrapped together, the loss is reduced, and the cost is saved.

Description

technical field [0001] The invention relates to the technical field of PCB board production, in particular to a method for measuring the resistance value of a buried resistance pattern in an inner layer of a circuit board. Background technique [0002] There is a process for making PCB boards, called buried resistance, which is to put chip resistors in the inner layer of the PCB board. These chip resistors are small in size and the resistance value can be set according to customer requirements. The PCB board produced in this way is the same as the normal PCB board. Similarly, many resistors are embedded in the inner layer, which saves a lot of space for placing components for the top and bottom layers. [0003] However, after lamination, the resistance pattern is embedded in the PCB board. This process needs to be treated with browning potion, and the press is laminated in a high-temperature and high-pressure environment. The resistance material will change due to chemical r...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R27/02G01R31/28
CPCG01R27/02G01R31/2812
Inventor 肖鑫黄双双樊廷慧李波
Owner HUIZHOU KING BROTHER CIRCUIT TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com