Fixed abrasive polishing device and polishing method

Abstract

The invention provides a fixed abrasive particle polishing device and a polishing method. The device includes a base pad, a polishing pad, a polishing liquid injection device and a clamping structure. The polishing pad is located on the base pad. One end of the polishing liquid injection device is connected to the polishing liquid source, and the other end extends above the polishing pad. The clamping structure is located on the polishing pad. The square is used to clamp the substrate to be polished, wherein the polishing pad includes a plurality of polishing belts, the plurality of polishing belts are arranged side by side, and there is a gap between adjacent polishing belts, and abrasive particles are fixed on each polishing belt. The invention creatively transforms the whole polishing pad into a plurality of polishing belts with gaps between each other, so that the impurity particles generated in the polishing process can be discharged from the gap in time, so as to avoid being retained on the polishing pad and scratching the substrate. At the same time, since the polishing areas of each polishing belt are independent of each other, one or more grinding effects can be achieved by selecting different abrasive grains and abrasive liquids in one polishing process, which can fully meet different polishing requirements.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a fixed abrasive particle polishing device and a polishing method. Background technique [0002] Chemical Mechanical Polishing (CMP) is an important method to obtain global planarization in integrated circuit manufacturing. The soft layer is relatively easy to remove, and then the soft layer is removed under the mechanical action of the abrasive in the polishing solution and the abrasive particles on the polishing pad, so that the surface of the substrate is exposed again, and then chemical reactions are carried out. The surface polishing of the substrate is completed in the alternating process of the action process. [0003] The fixed abrasive polishing table in the traditional chemical mechanical polishing equipment includes a whole round base pad and a whole piece of polishing pad rolled into a cylindrical shape and laid on the base pad, and the size is larger ...

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a fixed abrasive polishing device and a polishing method, which is used to solve the problem that the base pad and the polishing pad of the fixed abrasive polishing table in the prior art are both integral. Pad, the large particles falling from the substrate during the grinding process or the abrasive grains falling from the polishing pad will always exist on the polishing pad during the grinding process, which may cause scratches on the substrate. It will cause problems such as a decrease in equipment output and an increase in production costs.

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