Method for cleaning solder resist ink based on ultrasonic waves
A technology of solder mask ink and ultrasonic wave, which is used in the removal of conductive materials by chemical/electrolytic methods, secondary treatment of printed circuits, etc., can solve problems such as difficulty in ink cleaning, and achieve the effect of simple and fast process.
Inactive Publication Date: 2021-11-02
福州瑞华印制线路板有限公司
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[0004] The purpose of the present invention is to solve the disadvantages of difficult cleaning of ink on PCB boards that need to be unwashed in the prior art, and propose a method for cleaning solder resist ink based on ultrasonic waves
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[0017] The technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments. Apparently, the described embodiments are only a part of the embodiments of the present invention, not all of them.
[0018] refer to figure 1 and figure 2 , a method for cleaning solder resist ink based on ultrasonic waves, used to remove the ink in the middle hole of the plugged PCB board, the equipment and tools used include green oil stripper tank, ultrasonic sounder, high-pressure water gun, solder resist developing machine , water tank, the cleaning process includes the following steps: S1 soaking the board; soaking the plug hole PCB board that is being washed back in a green oil stripper tank equipped with an ultrasonic sounder; S2 preliminary cleaning; soaking the plug hole PCB board that has been soaked Clean the orifice plate in a sink, and use a high-pressure water gun to rinse the residual ink on the surface of the plate;...
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The invention discloses a method for cleaning solder resist ink based on ultrasonic waves. The method is used for removing ink in holes in a plugged PCB, and uses equipment tools comprising a green oil stripping agent tank, an ultrasonic generator, a high-pressure water gun, a solder resist developing machine and a water tank. The cleaning process comprises the following steps of: S1, board soaking; S2, primary cleaning; S3, ink stripping; and S4, secondary cleaning. Compared with the prior art, the method has the advantages that (1) ink in the plug hole can be cleaned more thoroughly; (2) a green oil stripping agent and the solder resist developing machine are adopted for soaking and cleaning, so that the printing ink which is not cleaned up can be identified and washed, and a worker can wash the plate more cleanly and thoroughly; and (3) ultrasonic wave is utilized to assist stripping, two-time cleaning and one-time cleaning under the solder resist developing machine are matched, ink in the hole with the hole diameter being smaller than 0.5 mm can be cleaned, and damage to the plate is avoided.
Description
technical field [0001] The invention relates to the field of electronic products, in particular to a method for cleaning solder resist ink based on ultrasonic waves. Background technique [0002] With the development of electronic products in the direction of "light, thin, short and small", PCBs are also developing towards high density and high difficulty, so there are a large number of SMT and BGA PCBs, and customers require plug holes when mounting components. Oil holes are all through holes. The via hole is also added with a conductive hole, which plays a role of connection and conduction in the circuit board. In order to prevent the short circuit caused by tin penetrating the component surface through the via hole when the PCB is over wave soldering, the flux remains in the via hole, and the surface solder paste flows into the hole to cause virtual soldering, which affects the placement. Pop-up, causing a short circuit, after the surface mount and component assembly of...
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IPC IPC(8): H05K3/22H05K3/06
CPCH05K3/22H05K3/06
Inventor 郭正平王正华詹少华
Owner 福州瑞华印制线路板有限公司