A kind of auxiliary device for pin welding of printed circuit board

Abstract

The invention discloses an auxiliary device for soldering pins of printed circuit boards, belonging to the technical field of soldering pins of circuit boards. The lower part of the inner baffle is supported on the upper edge of the pin hole of the circuit board. During the wave soldering process, the tin liquid flows upward through the gap between the pin and the pin hole, and is attached to the upper edge of the pin hole through the inner baffle tube, which can block the tin liquid overflowing upward and ensure the welding quality; and cooperate with the lower end of the outer sleeve It is attached to the surface of the circuit board to effectively prevent the contaminants from spreading and scattering around the surface of the circuit board; and is fastened with the pins through the small mouth end of the outer sleeve to prevent the contaminants from moving up along the pins and prevent the contaminants from entering. Inside the parts, the welding quality and welding safety are guaranteed; the overall structure is simple, the cost is low, the realization is easy, and the practicability is good.

Description

technical field [0001] The invention belongs to the technical field of circuit board pin welding, in particular to a printed circuit board pin welding auxiliary device. Background technique [0002] With the development of high technology, it is necessary to improve the function and performance of electronic products. The highly integrated process requirements make the printed circuit board more and more small and fine, and there are more and more stringent requirements for the surface technology of the device. [0003] The plug-in components need to adopt the wave soldering process, and the wave soldering is due to the particularity of the process, that is, the wave soldering is to make the soldering surface of the printed circuit board directly contact with the high-temperature liquid tin to achieve the purpose of welding. The device makes the liquid tin form a wave-like shape, which has a certain impact on the printed circuit board. [0004] During wave soldering, some c...

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem that some volatile substances in the flux of current wave soldering are easy to volatilize in the high-temperature wave soldering liquid to form a gaseous or liquid state, thereby forming the above-mentioned soldering pollutants, which will enter the printed circuit board along the pin hole The front of the circuit board, or along the pins of the component enters the interior of the component body, causing the component to fail; the pollutants on the front of the printed circuit board can be scattered to any position on the front of the printed circuit board, and there are risks of circuit short circuit and corrosion, which will cause The function of the printed circuit board is abnormal, and the welding pollutants adhere to the component pins for a long time, which will cause pollution and corrosion to the component pins, which will lead to the problem of abnormal function of the component. The invention provides a printed circuit board lead Foot Welding Aid

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