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Semiconductor structure and semiconductor layout structure

A layout structure, semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as large area, and achieve the effect of reducing size and high device density

Pending Publication Date: 2021-11-05
NAN YA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the number of antifuse increases, the traditional 1T1C structure will occupy a large area

Method used

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  • Semiconductor structure and semiconductor layout structure
  • Semiconductor structure and semiconductor layout structure
  • Semiconductor structure and semiconductor layout structure

Examples

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Embodiment Construction

[0028] The following disclosure provides many different embodiments or examples in order to achieve the different features of each embodiment. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these examples are only examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the ensuing description may include embodiments in which the first and second features are formed in direct contact, and may also include that additional features may be formed in the Between the first and second features, such that the first and second features may not be in direct contact. In addition, the present invention may repeat element symbols and / or letters in each example. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0029] Relative terms of space are ...

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PUM

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Abstract

The invention discloses a semiconductor structure and a semiconductor layout structure. The semiconductor layout structure includes a substrate, a plurality of gate structures, and a plurality of conductive structures. The substrate includes a plurality of active regions extending along a first direction, in which the active regions are separated from each other by an isolation structure. The gate structures extend across the active regions along a second direction that is perpendicular to the first direction, in which each of the active regions includes a pair of source / drain portions at opposite sides of each of the gate structures. The conductive structures are embedded in a first portion of the isolation structure disposed between the adjacent active regions in the first direction, wherein the conductive structures extend along the second direction and are separated from the source / drain portions by the isolation structure. Therefore, the semiconductor layout structure provided by the invention can reduce the size of a unit cell, thereby achieving high device density.

Description

technical field [0001] The invention relates to a semiconductor structure and a semiconductor layout structure. More particularly, the present invention relates to semiconductor structures and semiconductor layout structures having antifuse structures. Background technique [0002] Fuse elements are commonly used in semiconductor devices, such as semiconductor memory or logic devices. Antifuses have the opposite electrical characteristics of fuses, and a defective unit can be repaired by replacing it with a redundant unit. [0003] Typically, an antifuse needs to be controlled by a control gate adjacent to it. Therefore, a memory cell (unit cell) is defined as 1T1C, representing a transistor (gate) and a capacitor (antifuse). However, when the number of antifuse increases, the traditional 1T1C structure will occupy a large area. In order to achieve high density memory cells or redundancy, memory cells should be as small as possible. Contents of the invention [0004] ...

Claims

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Application Information

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IPC IPC(8): H01L23/525H01L27/112H01L27/02H10B20/00
CPCH10B99/00H10B20/20
Inventor 丘世仰
Owner NAN YA TECH
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