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Getter magnetic control target material

A technology of getter and magnetron target, which is applied in metal material coating process, ion implantation plating, coating, etc., and can solve problems such as unfavorable maintenance of normal work

Inactive Publication Date: 2021-11-16
安徽益东惠电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The getter magnetron target needs to be supplied with 380V AC during the working process, and is frequently hit by gas ions during the sputtering process, and a large amount of heat will be generated on the surface and inside of the target, which is not conducive to its normal operation. Therefore, we introduce A getter magnetron target welded with a copper backplate

Method used

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  • Getter magnetic control target material
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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] see Figure 1-2 , the present invention provides a technical solution: a getter magnetron target material, the getter magnetron target material includes a getter alloy target material 1 and a copper back plate 2, and the getter alloy target material 1 is the material for sputtering coating, and the copper back plate 2 plays the role of cooling, heat dissipation and magnetic conduction for the getter alloy target 1;

[0024] The raw material of the gett...

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Abstract

The invention discloses a getter magnetic control target material. The getter magnetic control target material is a main material to be loaded in getter sputtering coating equipment, the getter magnetic control target material comprises a getter alloy target material and a red copper back plate, and the red copper back plate is welded on the back surface of the getter alloy target material. A manufacturing process of the getter magnetic control target material specifically comprises the following steps of S1, zirconium powder, cobalt powder and rhenium powder are mixed and then put into a sheath mold, equal pressure is applied to a sheath in all directions by adopting a hot isostatic pressing process, and meanwhile, high temperature is applied, so that mixed alloy is sintered and densified to obtain a semi-finished product of the getter alloy target material; S2, the semi-finished product of the getter alloy target material subjected to hot isostatic pressing is cut into a rectangle to prepare a finished product of the getter alloy target material; and S3, the red copper back plate is welded to the back face of the getter alloy target material. According to the getter magnetic control target material, the red copper back plate is welded to the back face of the getter alloy target material, so that the red copper back plate plays a role in heat dissipation and magnetic conduction of the getter alloy target material.

Description

technical field [0001] The invention relates to the technical field of getters, in particular to a getter magnetron target. Background technique [0002] The purpose of making a magnetron sputtering target is to use it as a material for cathode sputtering. Gas ionization is generated by discharging the inert gas, and its positive ions bombard the cathode target at high speed under the action of an electric field, knock out the atoms or molecules of the cathode target, and fly to the surface of the plated substrate to deposit a thin film. [0003] The getter magnetron target is actually an alloy in which the getter is pressed into a block metal. Its use needs to grow the getter on the substrate, usually the surface or internal space of the substrate is coated with a layer Getter film, this getter film is activated under a certain vacuum pressure or an appropriate temperature, so as to absorb the active gas. [0004] The getter magnetron target needs to be supplied with 380V...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35B22F3/15B22F7/08B23K31/02
CPCC23C14/3407C23C14/3414C23C14/35B22F3/15B22F7/062B23K31/02
Inventor 吴文一
Owner 安徽益东惠电子科技有限公司
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