GBU packaged lead frame structure and GBU packaged structure

Abstract

The invention relates to the technical field of semiconductor manufacturing, and particularly discloses a GBU packaged lead frame structure which comprises a first frame body, a second frame body, a third frame body and a fourth frame body. The second frame body and the first frame body are arranged in parallel and at an interval, and the third frame body and the first frame body are arranged in parallel and at an interval. The corner, at least adjacent to the first frame body, of the second frame body and the corner, at least adjacent to the first frame body, of the third frame body are right-angled, the fourth frame body and the third frame body are arranged in parallel and at an interval, and the corner, at least adjacent to the third frame body, of the fourth frame body is right-angled. The invention further discloses a GBU packaged structure. The GBU packaged lead frame structure provided by the invention solves the problem that the size of a silicon wafer is limited due to the area of a base island in the prior art.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a lead frame structure of a GBU package and a GBU package structure. Background technique [0002] The lead frame of the standard GBU (Glass passivated Bridge rectifier Unit) package form is four base islands, the middle is connected to the silicon wafer and the outer pins through a Clip (jumper), and the process flow is to apply solder paste on the PAD (base island). Place the silicon chip on the solder paste, point the solder paste on the silicon chip, solder the jumper, and connect each other through four Clips (jumpers). [0003] Such as figure 1 As shown, the existing GBU packaging frame mainly has the following disadvantages: the area of ​​the tripod PAD is relatively small; the maximum size of the silicon chip that can be installed is limited (currently the maximum size of the silicon chip that can only be installed is 140mil, mil is the length unit, 1...

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Problems solved by technology

[0003] like figure 1 As shown, the existing GBU packaging frame mainly has the following disadvantages: the area of ​​the tripod PAD is relatively small; the maximum size of the silicon chip that can be installed is limited (currently the maximum size of the silicon chip that can only be installed is 140mil, mil is the length unit, 1mil =0.0254mm); the existing jumper is not bent, and the bumps on the tripod can only be used to meet the height gap of the jumper connection, so the thickness of the stencil needs to be increased by more than one bump height, so that the stencil production Increased difficulty

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