Die cutting part manufacturing method capable of reducing piece falling reject ratio in production process
A technology of chip defect rate and production process, which is applied in the direction of film/sheet adhesives, metal processing, adhesives, etc., can solve the problems of high chip defect rate and missing chips, and achieve smooth production of die-cut parts Effect
Active Publication Date: 2021-11-26
昊佰电子科技(上海)有限公司
View PDF10 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] However, when the die-cutting parts are punched and the waste is discharged, due to the fast return of the double-sided adhesive, the return force F between the double-sided adhesive and the double-sided adhesive 双 / 双 >Adhesion F between double-sided adhesive tape and base film 双 / 底 , when the waste is discharged, the double-sided adhesive waste will take away the finished double-sided adhesive together with the handle film of the product, resulting in missing pieces, such as Figure 12
According to preliminary statistics, the defect rate of chip dropping caused by the traditional die-cutting processing method is as high as 50%.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment
[0039] A method for manufacturing a die-cut piece that reduces the defective rate of chip drop in the production process, the method comprising the following steps:
[0040] (1) Lay the double-sided adhesive tape 2 and the auxiliary release film 3 on the bottom film 1 in sequence to form a primary material belt, such as image 3 ;
[0041] (2) Carry out a die-cutting of the primary material band, and get rid of the first waste material to form a secondary material band; the first die-cutting machine is provided with a knife line a, a knife line b and a knife mold A, such as Figure 4 , the punching layers of knife line a, knife line b and knife die A include auxiliary release film 3 and double-sided adhesive tape 2 in sequence. The purpose of setting the knife line b is to narrow the two sides of the primary material belt. When the double-sided adhesive semi-finished product is die-cut by the knife die B to form the double-sided adhesive finished product 21 and the double-sid...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a die cutting part manufacturing method capable of reducing the piece falling reject ratio in the production process. The method comprises the following steps that (1) a double faced adhesive tape (2) and an auxiliary release film (3) are sequentially attached to a bottom film (1) to form a primary material strip; (2) the primary material strip is subjected to primary punching die cutting, first waste is removed, and a secondary material strip is formed; (3) a handle film (4) is attached to the secondary material strip, secondary punching die cutting is carried out, handle film waste (42) is removed, and a die cutting part semi-finished product is formed; and (4) a waste discharge mylar (5) is attached to the die cutting part semi-finished product, third waste is discharged, and a die cutting part finished product is formed. Compared with the prior art, the method has the advantages that the method is simple and easy to implement, and the piece falling reject ratio in the production process is more effectively reduced.
Description
technical field [0001] The invention relates to the field of die-cut parts processing, in particular to a method for making die-cut parts which reduces the defect rate of chip dropping in the production process. Background technique [0002] For products with long handles, because the double-sided adhesive has a fast return speed, and because the double-sided adhesive has a hollow part, pre-pressing action cannot be performed, so you must choose a lighter peeling force, about 25- 35g, the base film. [0003] However, when the die-cutting parts are punched and the waste is discharged, due to the fast return of the double-sided adhesive, the return force F between the double-sided adhesive and the double-sided adhesive 双 / 双 >Adhesion F between double-sided adhesive tape and base film 双 / 底 , when the waste is discharged, the double-sided adhesive waste will take away the finished double-sided adhesive together with the handle film of the product, resulting in missing pieces,...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): B26F1/40B26D7/18C09J7/20B26F1/44
CPCB26F1/40B26D7/18C09J7/20B26F1/44
Inventor 周姿杜月华蒋建国
Owner 昊佰电子科技(上海)有限公司