Glass substrate circuit printing method and equipment

A technology for glass substrates and printing equipment, applied in printing devices, printing, typewriters, etc., can solve problems such as high equipment costs, product scrapping, and complex processes, and achieve the effects of improving yield rate, reducing process complexity, and solving process complexity

Pending Publication Date: 2021-11-26
西湖未来智造(杭州)科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the printing circuit method of etching and electroplating in the prior art has complicated process, high equipment cost, and serious pollution. The circuit made is easy to fall off due to poor adhesion of the material, and cannot be repaired after an error,

Method used

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  • Glass substrate circuit printing method and equipment
  • Glass substrate circuit printing method and equipment
  • Glass substrate circuit printing method and equipment

Examples

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Embodiment Construction

[0048] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0049] refer to figure 1 , figure 1 It is a schematic structural diagram of a glass substrate circuit printing device provided by an embodiment of the present invention. The printer base 2 is installed on the printer base 1, the ultra-high-precision motion control system 3 is connected to the printer base, the fixed bracket 4 is connected t...

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PUM

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Abstract

The invention relates to glass substrate circuit printing method and equipment. The equipment comprises an ultrahigh-precision motion control system which is connected with a computer and is used for controlling the movement speed and the printing receiving distance of a printing glass substrate circuit and a printing needle head; a sucker device is which connected with the ultrahigh-precision motion control system and comprises suckers for fixing a glass substrate; a height measurement and automatic following system which is connected with the computer and comprises a sensor and a sensor controller, wherein the sensor is used for measuring space coordinates of the glass substrate and the printing needle head; and a high-precision fluid control system which comprises a printing needle head and a fluid control system, wherein the fluid control system is used for providing preset air pressure for the printing needle head, the inner diameter of the printing needle head is matched with the preset printing line width, and the air pressure, the needle head movement speed and the printing receiving distance are matched with the printing needle head. According to the method and equipment, the printing yield and the production efficiency of the glass substrate circuit are improved.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a glass substrate circuit printing method and equipment. Background technique [0002] Since the 1950s, electronic equipment, including semiconductor equipment, has made great progress, among which printed circuit technology has played an important role. Printed circuits make mass production of electronic equipment easier and easier, making electronic equipment consistent in performance. Stable quality and compact structure. The printed circuit does not need to be soldered on the circuit board one by one, eliminating a lot of complicated manual wiring operations, and can achieve high precision, which greatly improves the production efficiency of the circuit board. [0003] The methods for printing circuits on glass in the prior art include the method of printing circuits by etching and electroplating and the method of printing circuits by printing. Among them, the printi...

Claims

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Application Information

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IPC IPC(8): B41J3/407B41J2/005B41J11/00B41J29/17B41J29/393
CPCB41J3/407B41J29/393B41J2/005B41J29/17B41J11/002
Inventor 周南嘉张若虚邹晨骁
Owner 西湖未来智造(杭州)科技发展有限公司
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