48results about How to "Solve the low yield rate" patented technology

The invention relates to a vehicle-mounted optical lens for monitoring. The vehicle-mounted optical lens for monitoring comprises a lens barrel, wherein a first lens, a second lens, a third lens, a diaphragm and a fourth lens which are sequentially arranged in the lens barrel from object space to image space. The first lens is a falcate spherical lens, the second lens is falcate aspheric lens, a first surface of the second lens facing the object space is a hyperbolic curve aspheric surface, and a second surface of the second lens facing the image space is an oval aspheric surface. The third lens is a biconvex spherical lens. The fourth lens is a falcate aspheric lens, and double surfaces of the fourth lens are hyperbolic curve aspheric surfaces. The vehicle-mounted optical lens for monitoring overcomes the shortcomings of the prior art, is high in pixel, ultra-wide in field, small in distortion and fog-transmitting, can be used for monitoring and can be used all day.

The invention relates to an optical lens, aims to overcome the defects in the prior art, and provides a high-image quality micro aspheric optical lens which is high in pixel and small in size, can be used for a digital camera and a mobile phone, and has a mixed lens structure. The lens comprises a lens cone, a bearing and a diaphragm; a first lens, a second lens, a third lens and a fourth lens are sequentially arranged in the lens cone from inside to outside; the first lens is a biconvex aspheric lens; the second lens has a section which is a falcate spherical surface; the third lens has a section which is a hyperbolic aspheric surface; and the fourth lens has a section which is a hyperbolic aspheric surface. The optical lens is mainly applied to camera cell phones.

The invention relates to a bonding technology for semiconductor manufacture, in particular to a bonding machine device and a bonding alignment method. The bonding alignment method comprises the following steps of: aligning a top alignment camera and a bottom alignment camera with a standard alignment identifier respectively; aligning a top chuck alignment identifier with the bottom alignment camera, and aligning a bottom chuck alignment identifier with the top alignment camera; aligning a top wafer alignment identifier with the top chuck alignment identifier; aligning a bottom wafer alignment identifier with the bottom chuck alignment identifier; aligning the top wafer alignment identifier with the bottom alignment camera, and aligning the bottom wafer alignment identifier with the top alignment camera; and bonding a top wafer and a bottom wafer, which are aligned. According to the bonding machine device and the bonding alignment method, an unknown parameter that whether chucks are aligned or not is substantially eliminated, so that the wafers can be aligned more accurately to solve the problems of low image sensor yield and long alignment time caused by low alignment degree in a bonding process, further improve the yield of an image sensor, reduce the time of the whole bonding process and improve the production efficiency.

The invention is applicable to the field of solar cell technology, and provides an oxidation passivation method and terminal device for a solar cell silicon wafer. The method comprises steps of: performing oxidation passivation treatment on the surfaces of a first preset number of solar cell silicon wafers through the oxidation passivation process; acquiring a first theoretical voltage value of the first preset number of solar cell silicon wafers after the oxidation passivation treatment; acquiring a second theoretical voltage value of a second preset number of solar cell silicon wafers; according to the first theoretical voltage value and the second theoretical voltage value, determining whether the oxidation passivation process is qualified; and when the oxidation passivation process isqualified, performing oxidation passivation treatment on the surfaces of solar cell silicon wafers expect the first preset number of solar cell silicon wafers and the second preset number of solar cell silicon wafers. The method can improve the yield of solar cells.

The invention relates to a semiconductor device manufacturing method based on self-aligned double patterning. The method comprises the following steps: a back-end-of-line device is provided, and a semiconductor substrate and a dielectric layer located on the semiconductor substrate are at least comprised; the dielectric layer is patterned to remove a part of the dielectric layer and form grooves; an APF material layer is deposited and planarized to fill the grooves; the APF material layer is etched to form grooves and strip-like core lines located between the grooves; a sidewall material layer is deposited on the substrate, and then the sidewall material layer is etched to form spacing walls on sidewalls of the strip-like core lines; and the strip-like core lines are removed through etching to form a parallel strip-like pattern without performing the end cutting step separately. According to the method of the invention, a target pattern can be obtained in the back-end-of-line (BEOL) of the semiconductor device without performing the end cutting step, so the process is simple and easy to control.

The invention relates to a steel ball transferring pressing seal device for lithium battery, which includes an upper model board and a lower model board which are oppositely disposed and between which a sliding board provided with ball transferring hole is arranged in parallel; the upper model board is provided a ball storage cavity for transferring steel ball which is aslant opened from up to down; one side of the bottom face of the lower model board is provided with a cavity for battery positioning and opened upwards, opposite to which a steel ball inducing hole which vertically drills through the lower board; and opposite to the steel ball inducing hole of the lower board, a pin hammer inducing hole is vertically arranged on the upper model board in coaxial, within which a pin hammer is disposed. In application, the steel ball aslant slides form the ball storage cavity into the transferring hole of the sliding board, and the sliding board drives the steel ball forward to input the same into the steel inducing hole, and then, the steel ball is pressed into a battery injection port by the pin hammer vertical motion via the steel ball inducing hole thereby completing the seal for battery cover. The device is not only suitable for the seal in normal condition, but is also suitable for vacuum seal; and it can automatically transfer and supply the steel balls one by one, accurately position, and has remarkable effect.

The invention provides a stroke control device of a press machine of an automobile sheet metal component. The stroke control device comprises a scaleplate, a lower fixing plate, an upper fixing plate, a cursor, a control / output panel, a female die, a male die, the press machine and a signal transmission line. When the press machine drives the male die to move, the cursor slides on the scaleplate under driving of the upper fixing plate, the control / output panel displays the scale where the cursor is located, the extension length of the press machine is regulated through the control / output panel according to the forming condition of the sheet metal component between the male die and the female die, and therefore accurate control over the stroke of the press machine is achieved.

The invention discloses a die-cutting bottom roller, which belongs to the field of die-cutting machines, and comprises a roller body, the surface of the roller body is provided with a cutting avoiding groove and an air suction hole, a die-cutting knife roller can be matched with two bottom rollers or a plurality of bottom rollers for multi-time die cutting, and the problem of low yield caused by incomplete waste removal during one-time forming of a film material can be avoided. The invention further discloses an automatic die-cutting machine, the automatic die-cutting machine comprises a die-cutting bottom roller and a knife roller which are fixed on a knife rest, the die-cutting bottom roller comprises a first bottom roller and a second bottom roller, the knife roller is located between the first bottom roller and the second bottom roller, and the knife roller is provided with an outer contour cutting edge and an inner contour cutting edge. The surface of the first bottom roller is provided with an outer contour cutting avoiding groove corresponding to the position of an outer contour blade of the knife roller. According to the automatic die-cutting machine, the design of the die-cutting bottom rollers is optimized, a compact and smooth two-bottom-roller and one-knife-roller structure is adopted, the working efficiency can be 1.5 times or above that of equipment of the same type, the waste material removing effect is remarkable, the rate of finished products can reach one hundred percent, and the automatic die-cutting machine can be applied to machining of mask materials, eye masks and the like.

The invention discloses a manufacturing method of an antenna cover plate and electronic equipment, and the method comprises the steps of: forming a demolding layer on a substrate; forming an antenna layer on the demolding layer to prepare an antenna diaphragm; attaching one surface of the antenna layer of the antenna diaphragm to a cover plate; and tearing off the substrate and the demolding layer so as to form the antenna layer on the cover plate. According to the technical scheme, the antenna diaphragm is firstly manufactured, then the antenna diaphragm is attached to the cover plate, and finally the substrate and the demolding layer of the antenna diaphragm are torn off, so that the antenna layer of the antenna diaphragm is transferred to the cover plate, and the manufacturing process of the antenna cover plate is simple and high in yield. Through the manufacturing method, the antenna layer can be placed at any position of the shell of the electronic equipment, the appearance is not influenced, the signal is enhanced, and the transmission / receiving effect is good.

The invention relates to a steel ball transferring pressing seal device for lithium battery, which includes an upper model board and a lower model board which are oppositely disposed and between which a sliding board provided with ball transferring hole is arranged in parallel; the upper model board is provided a ball storage cavity for transferring steel ball which is aslant opened from up to down; one side of the bottom face of the lower model board is provided with a cavity for battery positioning and opened upwards, opposite to which a steel ball inducing hole which vertically drills through the lower board; and opposite to the steel ball inducing hole of the lower board, a pin hammer inducing hole is vertically arranged on the upper model board in coaxial, within which a pin hammer is disposed. In application, the steel ball aslant slides form the ball storage cavity into the transferring hole of the sliding board, and the sliding board drives the steel ball forward to input the same into the steel inducing hole, and then, the steel ball is pressed into a battery injection port by the pin hammer vertical motion via the steel ball inducing hole thereby completing the seal for battery cover. The device is not only suitable for the seal in normal condition, but is also suitable for vacuum seal; and it can automatically transfer and supply the steel balls one by one, accurately position, and has remarkable effect.

The invention provides a semiconductor structure and a manufacturing method thereof, relating to the field of semiconductor manufacturing. The semiconductor structure comprises a silicon substrate, a wide band gap semiconductor layer formed on the silicon substrate and a silicon layer formed on the wide band gap semiconductor layer. The method comprises the steps of growing the wide band gap semiconductor layer on the silicon substrate and growing the silicon layer on the wide band gap semiconductor layer. The embodiment of the invention can be applied to manufacturing of semiconductor devices.

The invention belongs to the technical field of connector assembling, and particularly relates to automatic connector assembling equipment which comprises two sections of overturning material channels and a middle material channel connected between the two overturning material channels. One side of the conveying channel is provided with an overturning driving device for driving the overturning material channels to rotate along the axis parallel to the conveying channel, the other side of the conveying channel is provided with feeding devices corresponding to the positions of the two overturning material channels, and the side portion of each feeding device is provided with a loading device; the two loading devices are respectively arranged corresponding to two adjacent end parts or two far-away end parts of the two overturning material channels, the shifting fork structure is arranged corresponding to the conveying channel, the shifting fork translation driving mechanism and the shifting fork lifting driving mechanism are arranged corresponding to the shifting fork structure, and the two overturning material channels and the middle material channel are respectively provided with seams for the shifting fork structure to insert; the problems that an existing assembling mode is low in efficiency and low in yield are solved.

The invention relates to a method for flattening moso bamboo materials. The method comprises the following steps: after moso bamboo is cut into sections and stripped, a grooving machine is used to machine a group of oblique line grooves on the inner wall of the moso bamboo; bamboo chips with oblique line grooves are soaked in a clean water reservoir, taken out after the water content reaches the specified requirement and placed in a microwave oven; after heating for a certain period of time, the bamboo chips are taken out and placed on a hot plate of a hot press for hot-press flattening; flattened bamboo chips are stacked in good order so as to avoid warpage and deformation during cooling; and after cooling for a certain period of time, a thicknesser and a sliding table saw are used to machine the flattened bamboo chips into qualified flattened bamboo boards. The method can reduce the process complexity in the traditional bamboo processing, solve the problem of low outturn percentage in bamboo processing, and comprehensively improve the technological content and product added value of the bamboo ware industry, thereby having a wide development prospect.