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2results about How to "Improve lightness" patented technology

Integrated molded body and electronic device housing

The present application provides a laminated body having excellent thermal conductivity, lightness and rigidity, and an integrated molded body in which the laminated body is integrated with other components. The integrated molded body of the present application is an integrated molded body in which a structure formed of a thermoplastic resin and a reinforcing fiber is arranged on the outer peripheral portion of a laminated body in which at least a prepreg formed of a continuous carbon fiber and a resin is laminated, and the thermal conductivity λ1A in the fiber direction of the continuous carbon fiber of the first prepreg constituting the outermost layer of the laminated body is 100 [W / (m·K)] or more and 800 [W / (m·K)] or less. It is preferably used for an electronic device housing.
Owner:TORAY INDUSTRIES INC