The invention discloses an
alloy bonding wire of gold, silver and
palladium. The
alloy bonding wire comprises gold element, silver element,
palladium element and impurities, wherein the
mass percentage of the gold element is 1% to 5%; the
mass percentage of the
palladium element is 1% to 15%; the
mass percentage of the silver element is 80% or greater than 80%; and the balance is the impurities. A preparation method of the bonding wire comprises the following steps: step one, weighing raw materials; step two, preparing
alloy; step three,
casting; step four,
wire drawing; step five, cleaning; step six, annealing; and step seven, compound winding. Silver and palladium are pre-alloyed, gold and pure silver are cast into a rod material, and then
wire drawing, annealing, cleaning and compound winding are carried out to complete product preparation; in the preparation process, various technological parameters are reasonably used, the
processing performance of the silver-based alloy bonding wire is improved, and the
oxidation resistance and
corrosion resistance are greatly improved; and moreover, the bonding wire disclosed by the invention is
extremely good and stable in using performance, and can meet the requirement on the
performance quality of the bonding wire in the field of
semiconductor high-end packaging.