Method for growing graphene on structured copper base, cable core material and preparation method of cable core material
A technology of cable core material and graphene, which is applied in the direction of cable/conductor manufacturing, conductive materials, conductive materials, etc., can solve the problems of product conductivity decline, equivalent resistance increase, uneven current distribution, etc., and achieve good electrical performance , Improve life and performance, improve oxidation resistance and corrosion resistance
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[0038] The preparation method of the cable core material of the present invention is to form the copper-based graphene prepared by the above method through step S3: repressing, sintering and thermal sintering to obtain the cable core material. Wherein, the specific steps of step S3 include:
[0039] Step S31: performing a repressing operation on the copper-based graphene, the repressing operation is an isostatic pressing operation, and the isostatic pressure is 300-500 MPa;
[0040] Step S32: Sintering the repressed copper-based graphene under the protection of argon, the sintering temperature is 900°C, and the sintering time is 1-3 hours;
[0041] Step S33: putting the sintered copper-based graphene into a hot extruder and extruding it into a thin strip to prepare a cable core material, and the mold temperature in the hot extruder is 900°C.
[0042] It is worth mentioning that the direction in which the sintered copper-based graphene is put into the hot extrusion machine is ...
Embodiment 1
[0047] Step S1: Cut the copper foil according to the size of the mould, alternately stack 0.1g of copper foil and 4g of copper powder into the mould, press isostatically to form an ingot, and the isostatic pressure is 5MPa.
[0048] Step S21: Put the ingot into the crucible, and send it to the middle position of the chemical vapor deposition furnace; first, vacuum the chemical vapor deposition furnace, so that the air pressure in the chemical vapor deposition furnace drops slowly until the gas phase in the furnace drops to 10 -2 Pa, then open the argon gas valve, feed argon to flush the chemical vapor deposition furnace, and close the vacuum valve at the same time to remove other gases such as oxygen in the chemical vapor deposition furnace. When the air pressure in the furnace rises to normal pressure, adjust the argon valve to keep the argon flow at 120 sccm, and open the exhaust valve of the chemical vapor deposition furnace at the same time. Under the protection of 120sccm...
Embodiment 2
[0056] Step S1: Cut the copper foil according to the size of the mold, alternately stack 0.1g copper foil and 3g copper powder into the mold, and perform isostatic pressing to form an ingot. The isostatic pressure is 8MPa.
[0057] Step S21: Put the ingot into the crucible, and send it to the middle position of the chemical vapor deposition furnace; first, vacuum the chemical vapor deposition furnace, so that the air pressure in the chemical vapor deposition furnace drops slowly until the gas phase in the furnace drops to 10 -2 Pa, then open the argon gas valve, feed argon to flush the chemical vapor deposition furnace, and close the vacuum valve at the same time to remove other gases such as oxygen in the chemical vapor deposition furnace. When the air pressure in the furnace rises to normal pressure, adjust the argon gas valve to keep the argon gas flow at 100 sccm, and open the exhaust valve of the chemical vapor deposition furnace at the same time. Under the protection of ...
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