Sn-Ag-Cu-Cr-X lead-free soldering material and its preparation

A lead-free solder, sn-ag-cu-cr-x technology, applied in the direction of welding equipment, welding/cutting medium/material, welding medium, etc., can solve the problems of solder joint peeling, high price, high melting point, etc.

Active Publication Date: 2007-01-17
BEIJING COMPO ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current quaternary solders developed by the Sn-Ag-Cu system mainly include: Sn-Ag-Cu-Sb (ITRI recommends solder, but the price is high and the melting point is slightly higher, and the most important thing is that Sb has toxicity second only to Pb ) and Sn-Ag-Cu-Bi (USP4879096 and CAP1299471 solder, prone to solder joint peeling), Sn-Ag-Cu-Ni (USP4758407, slightly poorer oxidation resistanc

Method used

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  • Sn-Ag-Cu-Cr-X lead-free soldering material and its preparation
  • Sn-Ag-Cu-Cr-X lead-free soldering material and its preparation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Example 1 Preparation of Sn-Ag1.0-Cu0.9-Cr0.6-Al0.001:

[0023] According to weight percentage, Ag is 1.0%, Cu is 0.9%, Cr is 0.6%, and Al is 0.001%. The preparation process is as follows: 5.0 kg of Sn-Ag20 master alloy is prepared in a resistance furnace according to the weight ratio; 5.0 kg of Sn-Cu10 master alloy, 5.0 kg of Sn-Cr7.5 master alloy are prepared in a vacuum intermediate frequency induction melting furnace, and Sn-Cr7.5 master alloy is 5.0 kg. 5.0kg of Al5.0 master alloy, 5.0kg of Sn-P5.0 master alloy; during the preparation process: ① first melt the weighed pure Sn to 500°C in a resistance furnace, add the weighed Ag strip, stir and melt to the furnace temperature 400~500°C, stirring and holding for half an hour, pouring into square ingots to prepare Sn-Ag20 master alloy; ②First melt the weighed pure Sn in a vacuum induction melting furnace to 650°C, add the weighed pure Cu flakes , stirred and melted to the furnace temperature of 500-600°C, stirred and...

Embodiment 2

[0024] Example 2 Preparation of Sn-Ag2-Cu0.7-Cr0.3-Al0.01:

[0025] According to the weight percentage, Ag is 2.0%, Cu is 0.7%, Cr is 0.3%, and Al is 0.01%. The preparation of the master alloy is the same as Example 1. Weigh 20.0g of Sn-Ag20 master alloy, 14.0g of Sn-Cu10 master alloy, 8.00g of Sn-Cr7.5 master alloy, 0.40g of Sn-Al5 master alloy, and 157.6g of pure Sn. Then melt pure Sn in a resistance furnace and heat it to 300°C, add Sn-Ag20 master alloy, Sn-Cu10 master alloy, Sn-Cr7.5 master alloy and Sn-Al5 master alloy in turn, heat to 300°C for 10min, pour In the cylindrical mold, after the ingot is completely solidified, remelt the ingot to 300 ° C for 10 minutes, pull out the surface oxide slag, and pour it into the mold to make the ingot solder for later use.

Embodiment 3

[0026]Embodiment 3 Preparation of Sn-Ag2-Cu0.7-Cr0.1-P0.05:

[0027] According to weight percentage, Ag is 2.0%, Cu is 0.7%, Cr is 0.1%, and P is 0.05%. The preparation of the master alloy is the same as Example 1. Weigh 20.0g of Sn-Ag20 master alloy, 14.0g of Sn-Cu10 master alloy, 2.70g of Sn-Cr7.5 master alloy, 2.0g of Sn-P5 master alloy, and 1.3g of pure Sn16. First melt pure Sn in a resistance furnace and heat it to 300°C, then add Sn-Ag20 master alloy, Sn-Cu10 master alloy, Sn-Cr7.5 master alloy and Sn-P5 master alloy in turn, heat to 300°C for 10 minutes, and pour In the cylindrical mold, after the ingot is completely solidified, remelt the ingot to 300 ° C for 10 minutes, pull out the surface oxide slag, and pour it into the mold to make the ingot solder for later use.

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Abstract

A lead-free Sn-Ag-Cu-Cr-X solder is proportionally prepared from Cu, Cr, alloy of one or more of Ga, Bi, In, Ni, Ge, La, Ce, Sb, Mn and Zn, Ag, P and/or Al and Sn through smelting in vacuum or protecting atmosphere to preparing intermediate alloys Sn-Cu, Sn-Cr, Sn-Ag, Sn-P and Sn-Al, and proportional smelting.

Description

technical field [0001] A modified Sn-Ag-Cu-Cr lead-free solder and a preparation method thereof belong to the technical field of tin-based lead-free solder manufacture. Background technique [0002] As a new type of lead-free electronic packaging solder, it should have good process performance (low melting point, small melting range, good wettability, good corrosion and oxidation resistance, good mechanical properties, good conductivity), high process yield ( Fast spreading speed, high welding yield, high slag forming rate), good reliability of solder joints (high bonding strength of solder joints, good creep resistance), low cost, etc. At present, lead-free wave soldering has developed into two main alloy systems: Sn-Ag-Cu system and Sn-Cu eutectic system. If measured according to the user's value equation, both of them have inherent defects. The Sn-Ag-Cu solder containing 3-4% silver can provide good reliability and process yield, but the anti-oxidation and corrosion perf...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C1/03
Inventor 张富文刘静杨福宝贺会军胡强朱学新徐骏石力开
Owner BEIJING COMPO ADVANCED TECH
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