Alloy bonding wire of gold, silver and palladium and preparation method thereof
A technology of alloy bonding and wire, which is applied in semiconductor/solid-state device manufacturing, circuits, electric solid-state devices, etc., can solve problems such as no technological breakthroughs, achieve good performance, improve processing performance, and meet performance and quality requirements.
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[0020] Example 1
[0021] An alloy bonding wire of gold, silver and palladium, including gold element, silver element, palladium element and impurities, the mass fraction of gold element in total mass is 5%, the mass fraction of palladium element in total mass is 15%, and silver The mass fraction of elements in the total mass is 80%, and the impurities are zero.
[0022] The specific steps of the method for preparing the gold, silver and palladium alloy bonding wire are as follows:
[0023] Step 1. Weigh the raw materials: weigh gold with a purity of 99.999% or more, silver with a purity of 99.999% or more, and palladium with a purity of 99.99% or more;
[0024] Step two, prepare the alloy; the vacuum degree is 0.1*10 -3 The silver-palladium pre-alloy is prepared under the environment of pa and 1600℃, this vacuum can reduce the melting point of the pre-alloy;
[0025] Step three, casting: in the vacuum degree of 1*10 -3 In a pa medium frequency induction furnace, refining at 1300°C for...
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