Flexible circuit board

A flexible circuit board and circuit technology, applied in the direction of flexible printed circuit boards, printed circuits, printed circuits, etc., can solve the problems of high cost, inconvenient shaping and assembly, and cumbersome coating method, so as to reduce working hours and costs, The effect of easy product line assembly and easy quality control

Pending Publication Date: 2021-11-30
CAREER ELECTRONIC (KUNSHAN) CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing EMI material coating method is cumbersome and time-consuming, coupled with the variety of transmission wires, it is difficult to control the appearance size, so that the coated material is easy to stretch, resulting in poor conductivity, and there are still high costs and problems in shaping and assembling. Inconvenience and other issues need to be overcome

Method used

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  • Flexible circuit board
  • Flexible circuit board
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Embodiment Construction

[0050] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

[0051] see Figure 1 to Figure 4 , is a flexible circuit board according to an embodiment of the present invention, figure 1 A schematic diagram of the appearance of a flexible circuit board according to an embodiment of the present invention, figure 2 A schematic cross-sectional view of a non-bending area of ​​a flexible circuit board according to an embodiment of the present invention, image 3 A schematic cross-sectional view of a bending area of ​​a flexible circuit board according to an embodiment of the present invention, Figure 4 A schematic diagram of the appearance of a flexible circuit board after multiple inversions according to an embodiment of the present invention. Such as figure 1 and Figure 4 As shown, the flexible circuit board 100 of this embodiment includes a non-bending region 10 , a plurality of pl...

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Abstract

A flexible circuit board comprises a non-bending area, a plurality of electroplating through holes, a plurality of grounding sheets and an electromagnetic wave shielding film. The non-bending area comprises a dielectric layer, a first signal layer, a first insulating layer, a second signal layer and a second insulating layer, the dielectric layer is provided with a first surface and a second surface which are opposite, the first signal layer is arranged on the first surface of the dielectric layer, the first insulating layer covers the first signal layer, and the second signal layer is arranged on the second surface; and the second insulating layer covers the second signal layer. The plurality of electroplating through holes are arranged in the non-bending area. And the plurality of grounding sheets are arranged corresponding to the electroplating through holes. The electromagnetic wave shielding film covers the non-bending area. The flexible circuit board provided by the invention is tightly conducted and combined with the electromagnetic wave shielding film by virtue of an integral forming design, so that the transmission efficiency is optimized.

Description

technical field [0001] The invention relates to a flexible circuit board, in particular to a flexible circuit board with an all-covering integral molding design. Background technique [0002] With the advancement of science and technology, there is a greater requirement for faster signal transmission, and the material of the transmission line is gradually becoming thinner and thinner. At present, coaxial cables and single or multi-core cables are mainly used as the main transmission wires on the market, and they will be soldered and joined with flexible circuit boards with less wiring space restrictions. Since high-speed signal transmission is prone to noise (noise), therefore The outer layer of the transmission wire is coated with an electromagnetic interference (EMI) material for suppressing noise. [0003] However, the existing EMI material coating method is cumbersome and time-consuming, coupled with the variety of transmission wires, it is difficult to control the appe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11
CPCH05K1/0218H05K1/023H05K1/115H05K2201/05H05K2201/10371
Inventor 傅泓智
Owner CAREER ELECTRONIC (KUNSHAN) CO LTD
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