Processing method of bonding pad and LED display lamp
A technology of LED display lamps and processing methods, which is applied in the direction of printed circuits connected with non-printed electrical components, electrical connection formation of printed components, instruments, etc., which can solve the problems of prolonging the production cycle, cumbersome heating process, and the inability to control the distance of LED chips, etc. problem, to achieve the effect of simplifying the processing flow and reducing the difficulty of processing
Pending Publication Date: 2021-11-30
NANCHANG O FILM DISPLAY TECH CO LTD
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Problems solved by technology
By heating, the heat-shrinkable paint shrinks and gathers on the conductive circuit, and the LED chip is fixed on the tin plate by heating the heat-shrinkable paint. At present, the corresponding heating equipment is used to heat the heat-shrinkable paint, or the practical spray gun is used for heating. The heating process is cumbersome, and the distance between two adjacent LED chips cannot be controlled, so the production cycle will be prolonged
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[0038] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.
[0039] In the prior art, the pad includes a substrate, and a positive conductive line and a negative conductive line are laid on the surface of the substrate, and the surface of the positive conductive line and the negative conductive line away from the substrate is coated with a heat-shrinkable coating that can melt and shrink after being heated. In the process of processing the heat-shrinkable coating, it is generally necessary to use heating equipment to heat the heat-shrinkable coating, which makes the processing process of the entire pad more troublesome, and because the...
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The invention discloses a processing method of a bonding pad and an LED display lamp. The bonding pad comprises a substrate, a positive conductive circuit and a negative conductive circuit; the processing method comprises the following steps: coating a heat-shrinkable coating capable of heat shrinkage on the surfaces, deviating from the substrate, of the positive conductive circuit and the negative conductive circuit along a first direction, wherein the heat-shrinkable coating forms a bonding pad primary body, the pad primary body has a portion connecting the positive conductive line and the negative conductive line, and the first direction intersects the positive conductive line and the negative conductive line and energizes the positive conductive line and the negative conductive line; electrically connecting the positive conductive circuit and the negative conductive circuit to enable the bonding pad primary body connected between the positive conductive circuit and the negative conductive circuit to form a current path from the positive conductive circuit to the negative conductive circuit, so the bonding pad primary body shrinks after being heated, the positive electrode connection bonding pad is connected with the positive conductive line, and the negative electrode connection bonding pad is connected with the negative conductive line. The heat-shrinkable coating shrinks after being heated, so that the heat-shrinkable coating is prevented from being heated by means of a tool, and the processing flow of the LED display lamp is simplified.
Description
technical field [0001] The present application relates to the field of surface display, in particular to a method for processing welding pads and LED display lamps. Background technique [0002] The existing LED light source structure includes a substrate, a conductive circuit laid on the substrate with a tin plate, and a heat-shrinkable coating placed on the tin plate that can be melted by heating. By heating, the heat-shrinkable paint shrinks and gathers on the conductive circuit, and the LED chip is fixed on the tin plate by heating the heat-shrinkable paint. At present, the corresponding heating equipment is used to heat the heat-shrinkable paint, or the practical spray gun is used for heating. The heating process is cumbersome, and the distance between two adjacent LED chips cannot be controlled, thus prolonging the production cycle. Contents of the invention [0003] The embodiment of the present application provides a pad processing method and an LED display lamp, ...
Claims
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Login to View More IPC IPC(8): H05K3/40H05K3/12H05K1/18G09F9/33
CPCH05K3/4007H05K3/12H05K3/1283H05K1/181G09F9/33
Inventor 田舒韵张礼冠田雨洪
Owner NANCHANG O FILM DISPLAY TECH CO LTD