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Metal shell lead structure capable of reducing glass cracks

A technology of metal leads and metal shells, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as glass insulator cracks, circuit sealing failure, etc., to achieve the effect of improving insulation effect, facilitating production and processing, and improving applicability

Pending Publication Date: 2021-12-03
XIAN MICROELECTRONICS TECH INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problem of cracks in the glass insulator at the root of the metal lead caused by the deformation of the metal lead and the failure of the circuit seal when the metal lead is subjected to abnormal external force in the prior art, the present invention provides a method for reducing glass cracks. The lead structure of the metal shell is simple in structure, so that when the metal lead is deformed by external force, the force point is transferred from the insulating ring to the intersection of the metal lead and the stressed structure, so as to avoid cracks caused by the force of the insulating ring

Method used

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  • Metal shell lead structure capable of reducing glass cracks
  • Metal shell lead structure capable of reducing glass cracks
  • Metal shell lead structure capable of reducing glass cracks

Examples

Experimental program
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Effect test

Embodiment 1

[0044] The diameter of the metal lead 1 is 0.38mm, which is a flexible lead, and the diameter of the force-bearing structure 2 is 0.8mm. The metal lead wire 1 is also easily deformed after being subjected to external force, but after deformation, the stress point is shifted to the part where the thickness of the metal changes, and the glass insulator avoids stress, and no longer introduces glass cracks and sealing air leakage problems.

Embodiment 2

[0046] The diameter of the metal lead 1 is 0.45mm, which is a flexible lead, and the diameter of the force-bearing structure 2 is 1.0mm. The metal lead wire 1 is also easily deformed after being subjected to external force, but after deformation, the stress point is shifted to the part where the thickness of the metal changes, and the glass insulator avoids stress, and no longer introduces glass cracks and seal air leakage problems.

Embodiment 3

[0048] The diameter of the metal lead 1 is 0.50mm, which is a flexible lead, and the diameter of the force-bearing structure 2 is 1.0mm. The metal lead wire 1 is also easily deformed after being subjected to external force, but after deformation, the stress point is shifted to the part where the thickness of the metal changes, and the glass insulator avoids stress, and no longer introduces glass cracks and seal air leakage problems.

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Abstract

The invention provides a metal shell lead structure capable of reducing glass cracks. A plurality of insulating rings are correspondingly embedded in a plurality of metal lead holes respectively, a plurality of metal leads correspond to the plurality of metal lead holes respectively and penetrate through the insulating rings, the insulating rings effectively play an insulating role, a stress structure is arranged at the position, wrapping the metal lead, of each insulating ring, when the metal lead deforms due to external force, the connecting positions of the metal leads and the stress structures bear deformation force, and the insulating rings are prevented from being broken.

Description

technical field [0001] The invention relates to the field of metal shells for integrated circuits, in particular to a metal shell lead structure for reducing glass cracks. Background technique [0002] The shell is a main part of the circuit module as a whole, which plays a role in mechanical support and protection of the chip, external functional interconnection, environmental conditions for circuit use, and packaging forms that should meet circuit characteristics, etc., and plays a fundamental role in guaranteeing. [0003] Metal casings used in integrated circuits (including hybrid integrated circuits, semiconductor integrated circuits, discrete devices, etc.), and their lead insulators are mostly made of glass. The metal leads and the housing body are tightly interconnected through glass insulators to form a hermetically sealed package. When the outer lead wire is subjected to abnormal external force, the lead wire is easily deformed, and the deformation of the lead wir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/10H01L23/00
CPCH01L23/10H01L23/562
Inventor 周海
Owner XIAN MICROELECTRONICS TECH INST
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