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Method for processing semiconductor insulating ring

A processing method and an insulating ring technology, which are applied to metal processing equipment, manufacturing tools, and parts of grinding machine tools, can solve problems such as long processing time, troublesome processing, and reduced processing efficiency, so as to improve work efficiency and shorten processing time , to avoid the effect of stuck phenomenon

Active Publication Date: 2021-12-07
杭州大和江东新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is a semiconductor insulating ring on the market. The upper surface of the ring has a variety of ring groove features. This complex feature requires the machining center to move the milling contour from the X, Y, and Z directions. Due to the need for milling allowance more, so the processing time is longer
In order to improve the efficiency, we will use the CNC lathe to process the large fluctuations in the ring groove first, and then use the machining center to mill the complex ring groove on the surface of the ceramic ring. Reduced processing efficiency

Method used

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  • Method for processing semiconductor insulating ring
  • Method for processing semiconductor insulating ring
  • Method for processing semiconductor insulating ring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Embodiment 1: a kind of semiconductor insulating ring processing method (see attached figure 1 to attach image 3 ), including the following steps:

[0031] a. Pour the ceramic powder into a ring mold after removing impurities, and form a ring-shaped ceramic blank A after isostatic pressing the ceramic powder in the ring mold;

[0032] b. Roughly process the ceramic blank A to make it close to the actual size of the product, and put it into a sintering furnace for sintering, so that the ceramic blank A becomes a dense polycrystalline ceramic material B;

[0033] c. Process the inner and outer diameter and thickness of polycrystalline ceramic material B to the actual size of the product to obtain material C1;

[0034] d. Clamp the designed special tool 2 and material C on the CNC lathe. The special tool is provided with a processing convex ring 3. The contour of the processing convex ring matches the ring groove on the semiconductor insulating ring, and the CNC lathe i...

Embodiment 2

[0037] Embodiment 2: a kind of semiconductor insulating ring processing method (see attached Figure 4 , attached Figure 5), the steps are similar to those in Example 1, the main difference is that in this embodiment the connecting hole on the special tool is adapted to connect with the installation shaft, the installation shaft and the special tool can rotate with each other, and there is a mounting shaft on the outer wall of the end of the installation shaft Groove 9, installation groove is evenly provided with two, connects arc bar 10 in the installation groove, is provided with the easily breakable tendon 11 of some spaced arrangement on the arc bar outer wall, easily breakable rib connects top piece 12, on the connection hole side wall and The arc-shaped bar is correspondingly provided with an arc-shaped accommodation groove 13, and the top block is placed in the accommodation groove, and the top block can abut against the end of the accommodation groove; the special too...

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Abstract

The invention discloses a method for processing a semiconductor insulating ring, and aims to overcome the defects of long processing time and low efficiency of the semiconductor insulating ring. The method comprises the following steps: a, removing impurities from ceramic powder, filling the ceramic powder into an annular mold, and performing isostatic pressing on the ceramic powder in the annular mold to form an annular ceramic blank A; b, performing rough machining on the ceramic blank A, putting the ceramic blank A into a sintering furnace to be sintered, and enabling the ceramic blank A to become a compact polycrystalline ceramic material B; c, processing the inner diameter, the outer diameter and the thickness of the polycrystalline ceramic material B to the actual product size, and obtaining a material C; and d, clamping a designed special cutter and the material C to a numerical control lathe, arranging a machining convex ring on the special cutter, wherein the outline of the machining convex ring is matched with the annular groove in the semiconductor insulation ring, rotating the material C after being clamped and positioned, enabling the special cutter to axially move and descend, and grinding the surface of the material C through the machining convex ring on the special cutter, therefore, the semiconductor insulating ring with the ring groove is formed.

Description

technical field [0001] The invention relates to an insulating ring processing technology, more specifically, it relates to a semiconductor insulating ring processing method. Background technique [0002] With the increasing development of the performance of ceramic materials and processing technology, ceramic products have gradually developed from the earliest handicrafts to the current special ceramics with various specific industrial properties. Compared with metal materials, ceramic materials have excellent effects in various equipment due to their high temperature resistance, wear resistance, corrosion resistance, high hardness, no metal pollution, and insulation. [0003] With the wide application of ceramic materials, more and more products are changed to ceramic materials, so the structure and size of ceramic products are also more diverse. At present, there is a semiconductor insulating ring on the market. The upper surface of the ring has a variety of ring groove f...

Claims

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Application Information

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IPC IPC(8): B24B1/00B24B19/02B24B41/04B24B41/00B28B3/00B28B11/08B28B7/00
CPCB24B1/00B24B19/02B24B19/008B24B41/04B24B41/00B28B3/003B28B11/08B28B7/0097
Inventor 倪晓锋姚相民李奇马玉琦周斌
Owner 杭州大和江东新材料科技有限公司