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Wafer processing method and wafer processing apparatus

A processing method and technology of processing equipment, which are applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve problems such as defective processing equipment, wafer cracks, and inability to obtain processing results, and achieve the effect of preventing wrong selection.

Pending Publication Date: 2021-12-07
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the wrong processing conditions are selected, not only the desired processing results cannot be obtained, but also damage such as cracks and chips may occur on the wafer or the processing equipment may malfunction.

Method used

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  • Wafer processing method and wafer processing apparatus
  • Wafer processing method and wafer processing apparatus
  • Wafer processing method and wafer processing apparatus

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] An embodiment of one embodiment of the present invention will be described with reference to the drawings. First, the wafer 1 and the like to be processed will be described. The wafer 1 is a substantially disk-shaped substrate, and is formed of materials such as silicon, SiC (silicon carbide), GaN (gallium nitride), and other semiconductor materials. In addition, the wafer 1 may also be formed of materials such as sapphire, glass, and quartz.

[0024] figure 1 (A) is a perspective view of the wafer 1 etc., figure 1 (B) is a plan view of the wafer 1 and the like. On the front surface 1a of the wafer 1, a plurality of planned dividing lines 3 called streets are set and intersect each other.

[0025] Devices 5 such as ICs and LSIs are formed in each region divided by a plurality of dividing lines 3 . On the outer peripheral portion of the wafer 1, a notch-shaped mark 1c called a notch indicating the crystal orientation of the wafer 1 is formed. However, the mark 1c i...

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PUM

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Abstract

A wafer processing method and a wafer processing apparatus are provided to prevent mistakes in selection of processing conditions. The processing method for a wafer with a mark formed in an outer peripheral portion thereof by utilizing the processing apparatus provided with a processing unit and a display unit includes following steps: a preparation step of preparing a frame unit having the wafer, a tape attached to the wafer, and a ring frame to the inner periphery of which the tape is attached; a processing condition selecting step of selecting processing conditions for processing the wafer by utilizing the processing unit; a representative image displaying step of allowing the display unit to display a representative image associated with the processing conditions and registered in the processing apparatus. The ring frame includes a notch formed in an outer periphery thereof. In the frame unit, the mark and the notch are in a positional relationship set in accordance with the processing conditions. A representative embodiment of the frame unit in which the notch of the ring frame and the mark of the wafer are in the positional relationship is presented in the representative image.

Description

technical field [0001] The present invention relates to a wafer processing method and processing apparatus for processing a wafer supported by an opening of a ring frame via an adhesive tape. Background technique [0002] When manufacturing a device chip mounted on an electronic device, first, on the front surface of a semiconductor wafer, a plurality of dividing lines crossing each other are set, and an IC (Integrated Circuit: integrated circuit) or IC is formed in each area divided by the dividing line. Devices such as LSI (Large Scale Integration: Large Scale Integration). Then, the wafer is ground by a grinding device from the back side to make the wafer thin, and the wafer is divided along planned dividing lines by using a cutting device, a laser processing device, or the like. Thus, individual device chips can be obtained. [0003] In various processing apparatuses such as grinding apparatuses, cutting apparatuses, and laser processing apparatuses, wafers are process...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78H01L21/67H01L21/683H01L23/544
CPCH01L21/78H01L21/67092H01L21/6836H01L23/544H01L2221/68327H01L21/681H01L2221/68309H01L2223/54493H01L2223/54426H01L2223/5442H01L2223/54453H01L21/67294H01L2221/68336H01L21/3043H01L2221/6834H01L21/687
Inventor 斋藤良信
Owner DISCO CORP