Socket, IC package, and method for mounting contact piece to connector housing

Abstract

The invention provides a socket, an IC package, and a method for mounting a contact piece to a connector housing, wherein the socket can be accurately mounted at a target position on a substrate. The socket is provided with a housing having: a bottom part which serves as the bottom of an opening for accommodating an IC package and which is provided with a plurality of through-holes; two pairs of side wall parts that face each other with the opening therebetween, and are provided with a plurality of ribs that protrude outward on the pair of side wall parts; a plurality of contact pieces which pass through the plurality of through holes, are exposed to the opposite side of the opening, and are supported by the housing; and a bracket having a plurality of support holes, the ribs passing through the support holes and being fixed to the side surface of the housing. Therefore, a part of the lower end of the bracket extends to the lower side of the lower end of the shell and is bent outwards, and the bent part forms a mounting surface which is soldered on the substrate.

Description

technical field [0001] The present invention relates to a socket for high-speed transmission mounted on a circuit board. Background technique [0002] Some of the LGA (Land grid array, contact array package) packages are not directly mounted on the circuit board itself, but are mounted on the circuit board through a dedicated socket. There is Patent Document 1 as a document disclosing technology related to such an LGA package socket. For the socket for electronic components disclosed in Patent Document 1, the bottom of the housing adopts a metal plate with a plurality of through holes, the signal contact pieces and the ground contact pieces arranged in a grid are inserted through the metal plate through holes, and the contact pieces are fixed on the metal plate. case. The contact piece of the electronic component socket has: a terminal base, which extends in a straight line; a bent portion, which is bent in an "L" shape at the lower end of the terminal base; ”; and a conn...

AI Technical Summary

Problems solved by technology

[0004] However, in the case of the technology of Patent Document 1, there is a problem that when the solder is melted by reflow, the solder moves up and down and sinks, and the positioning accuracy of the contact piece on the substrate deteriorates.

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