Chamber cooling unit of heat treatment furnace

A heat treatment furnace and cooling unit technology, applied in furnace cooling devices, electrical components, drying chambers/containers, etc., can solve the problems of insufficient high-performance process capability, product quality restrictions, difficult chamber high temperature, etc., and achieve improvement Safety of use and performance of heat treatment furnaces, prevention of burnout or normal malfunction, and effect of improving energy efficiency

Pending Publication Date: 2021-12-10
コヨサーモシステムコリアカンパニーリミテッド
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, although the existing heat treatment furnace uses a heater system in the chamber to remove the residual moisture on the substrate, it is difficult to effectively control the high temperature of the chamber, so the improvement of the quality of products produced in batches is limited, and it cannot fully meet the high-performance process capability
[0010] In addition, in order to improve the production efficiency of products by shortening the process time, the existing heat treatment furnaces have limitations in terms of quickly reducing the temperature while structurally satisfying the durability of the chamber when the chamber is cooled.

Method used

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  • Chamber cooling unit of heat treatment furnace
  • Chamber cooling unit of heat treatment furnace
  • Chamber cooling unit of heat treatment furnace

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Embodiment Construction

[0056] Hereinafter, the content of the cooling unit of the heat treatment furnace chamber according to the preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0057] Generally, the front side of the heat treatment furnace for heat treatment of substrates can have a shutter, and the rear side can have a furnace door, so that the substrates to be heat treated can be put into the preset tables in the chamber or the substrates after the heat treatment process can be removed from the chamber.

[0058]In addition, the heat treatment furnace has a chamber for accommodating a substrate to be heated or dried, and a heating body composed of a heater is installed in the chamber so that the substrate can be heated with heat generated from the heater or dried by evaporating moisture. In addition, although it varies depending on the configuration, generally the upper and lower parts of the heater are provided with upper / low...

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Abstract

The present invention discloses a chamber cooling unit of a heat treatment furnace. The chamber cooling unit of the heat treatment furnace of the present invention includes a heat treatment furnace having a chamber for accommodating a substrate for heating or drying the substrate, wherein a heating element composed of a heater is installed in the chamber, so as to use the heat of the heater to heat or dry the substrate; a cooling airflow channel formed along the inner and outer boxes of the chamber: at least one cooling jacket located on the outer side of the chamber in a vertical direction so that a cooling airflow is formed in the cooling airflow channel formed inside the chamber.

Description

technical field [0001] The present invention relates to a chamber cooling unit of a heat treatment furnace for effectively cooling the chamber of the heat treatment furnace. Background technique [0002] Organic light-emitting display devices and LCD glass substrates are used in various image devices such as image screens, TVs, mobile phones, and monitors. Organic light-emitting display devices and LCD glass substrates are being used in various fields as one of the next-generation displays. Recently, the development of flat-panel display manufacturing technologies in this field is progressing in order to improve performance and yield. [0003] In the process of manufacturing organic light-emitting display devices or LCD glass substrates (hereinafter referred to as 'substrates' or 'glass substrates'), which are typical flat panel displays, temperature control and temperature uniformity are essential to ensure high substrate quality and yield . [0004] For example, in the m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F27D1/12F26B25/12H01L21/67H10K99/00
CPCF27D1/12F26B25/12H01L21/67109Y02P70/50G02F1/1303G02F1/133302H10K71/40H10K71/00
Inventor 金珉哲中西识
Owner コヨサーモシステムコリアカンパニーリミテッド
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