A lead frame conveying punching device

Abstract

A lead frame conveying and punching device relates to the related technical field of semiconductor processing or punching common parts, which includes a conveying component, a pushing component is provided at the discharge end of the conveying component, and a punching component is provided at the discharge end of the pushing component. When processing the lead frame, the present invention is mainly used for the placement and limit delivery of the lead frame roll, the winding recovery of the septum belt, the push operation of the lead frame by means of pushing, the punching and cutting of the lead frame and the lead frame collection of stacks. When the lead frame roll is conveyed, the lead frame roll can be fixed, thereby ensuring the stability of the lead frame during conveyance, and the push operation of the lead frame is facilitated by limiting the lead frame roll during conveyance. When the frame roll is conveyed, the intermediate belt can also be wound and collected, so as to facilitate the recycling and reuse of the intermediate belt.

Description

technical field [0001] The invention relates to the related technical field of semiconductor processing or punching common parts, in particular to a lead frame conveying punching device. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the external lead by means of a bonding material, forming an electrical circuit. It acts as a bridge connecting the external wire. Most of the semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] The lead frame generally needs to be treated on the outer surface of the copper material during processing. This treatment is mainly to improve the oxidation resistance of the lead frame and enhance the conductivity, and then pass the strip-shaped copper material through the punching device. The le...

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Problems solved by technology

[0003] The lead frame generally needs to be treated on the outer surface of the copper material during processing. This treatment is mainly to improve the oxidation resistance of the lead frame and enhance the conductivity, and then pass the strip-shaped copper material through the punching device. The lead frame is punched and engraved through the mold in the punching device, and then the strip-shaped copper material is wound on the reel, in order to prevent the pins on the lead frame from being linked to each other, or the impression frame deformation, and wear on the outer wall of the lead frame during winding, so during the winding process, it is also necessary to wind a layer of spacer tape between the lead frames synchronously, and the use of the spacer tape is used in the punching of the lead frame When slitting, it is also convenient to transport the lead frame, but when the existing lead frame is transported, it is first of all inconvenient to carry out the fixed placement of the lead frame coil, that is, the copper coil, so that it is inconvenient to control the transport speed, etc.; Secondly, the partition belt is discharged in a messy manner during transportation. When it is recycled and reused later, the operator needs to rewind and use it again; moreover, it is inconvenient to use the roller conveying method for the existing punching and cutting. This transportation method is prone to slippage, which affects the accurate transportation of the lead frame, and then affects the punching and cutting accuracy of the lead frame; finally, it is inconvenient to carry out the stacking operation of the lead frame after punching and cutting , thus increasing the workload of the later stage

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