Solder mask silk printing device for high-density circuit board production and implementation method thereof

Abstract

The invention relates to the technical field of solder mask silk printing, and discloses a solder mask silk printing device for high-density circuit board production, the solder mask silk printing device comprises a vertical support and an octahedral rotating ring arranged on one side of the vertical support, the upper end of the vertical support is provided with a connecting block, one end of the connecting block is provided with a lifting sheath, and the lower end of the lifting sheath is provided with an ink scraping assembly. A circuit board can be spontaneously collected between a pressing plate and a limiting plate, then the circuit board is limited, the circuit board is convenient to assemble and disassemble, the circuit board is aligned with the ink scraping assembly, the subsequent ink scraping effect on the circuit board is enhanced, and the silk printing quality of the circuit board is improved. The invention further discloses an implementation method of the solder mask silk printing device for high-density circuit board production. The contact range of a scraper blade strip and the pressing plate is expanded, then the ink scraping range corresponds to the end face of the octahedral rotating ring, the ink scraping uniformity of the surface of the circuit board is improved, the octahedral rotating ring is continuously rotated by 45 degrees, the circuit board is alternately assembled and disassembled, and the working efficiency is improved through eight stations.

Description

technical field [0001] The invention relates to the technical field of solder resist screen printing, in particular to a solder resist screen printing device for high-density circuit board production and an implementation method thereof. Background technique [0002] The existing anti-soldering method is generally to pre-treat the copper plate, fill the holes with ink when printing the screen, and print the dot screen at the same time, then stand still, pre-bake, stand still and follow-up alignment, exposure, Standing, developing and post-baking processes. [0003] During the process of solder mask screen printing on circuit boards, it is necessary to scrape the surface of the printed circuit board with the ink scraper to help the ink enter the holes of the circuit board. The ink knife cannot touch the corners of large-sized circuit boards, and the ink scraping range is limited, which affects the silk screen printing quality of the circuit boards. The existing technology on...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a kind of high-density circuit board production with anti-solder screen printing device and its implementation method, to solve the background technology in the circuit board in the process of solder-resist screen printing, need to use the scraper to print the circuit board with ink The surface is scraped together to help the ink enter the holes of the circuit board. However, due to the different sizes of the circuit boards, a single-length scraper blade cannot touch the corners of larger-sized circuit boards. The range of ink scraping is limited, which affects the circuit board. The quality of silk screen printing, the existing technology only has a single station, the work efficiency is low, the staff still need to manually align the circuit board, the operation is cumbersome, and the positioning effect cannot be guaranteed

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