Device and method for measuring mechanical property of film under high temperature

Abstract

The invention discloses a device and a method for measuring mechanical property of a film under high temperature. The measuring device comprises an optical measurement component, a data processing and displaying component, a dynamic loading component, a heating component and a sample platform, wherein the optical measurement component, the heating component, the sample platform and the dynamic loading component are successively arranged; light sources and light spots sent during measurement are unchanged; due to the bulging effect, the film is deformed; a reflection angle of a light path transmitted to the film is changed due to the deformation of the film; the optical measurement component for receiving a reflected light path is remotely connected to the data processing and displaying component; the received light path is obtained by the optical measurement component; and the data processing and displaying component is used for visually displaying the measurement process and recording the change of the received light path. Through the measuring device, a heating device and a bulging device are combined together to measure the mechanical property of the film under high temperature; the measuring device is compact in structure, is applied to the films of various elasto-plastic systems, and is capable of achieving real-time and full-field measurement of the change of the mechanical property in the heating process.

Description

technical field [0001] The invention relates to a full-field measurement device and method for the mechanical behavior of a thin film at high temperature, and belongs to the technical fields of photometric mechanics, structural deformation and mechanical experiments. Background technique [0002] Thin film refers to the material structure whose thickness direction is much smaller than other directions, and the thickness generally does not exceed 10 μm. Because it is different from the matrix material and has certain strengthening, protection or special functions, it is widely used in micro-nano, microelectronics and materials. In the field of technology, the application of thin film is very extensive. Thin film science and technology is the basis of microelectronics, information, sensors, optics, solar energy utilization and other technologies, and it has widely penetrated into various fields of contemporary science and technology. In order to meet different industrial appl...

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Problems solved by technology

The device has a compact structure and can realize online and real-time monitoring of the mechanical property changes of the multilayer film matrix structure during the heating process. Change in curvature by changing temperature

The disadvantage is that the components except the controller and the optical microscope are inside the heating furnace, and the preparation of the thin film sample to be tested is complicated. It is necessary to pre-grow the thin film on a glass substrate with a layer of photoresist, and then add the thin film The photoresist structure is imprinted on the thin plate, and the loading speed of the pressing device cannot be stably controlled

The heating method it adopts is to set a heating platform under the film sample to be tested, and the temperature of the heating platform is transferred to the surface of the sample. The measurement results of the nanoindenter are very sensitive to temperature, so it is necessary to configure a cooling system for this equipment. And the heating temperature range is also very limited

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