Device and method for measuring mechanical property of film under high temperature

A measuring device, high temperature mechanics technology, applied in measuring device, using stable tension/pressure test material strength, scientific instruments and other directions, can solve the problem that the loading speed of the pressure device cannot be stably controlled, the preparation of the film sample to be measured is complex, The heating temperature range is limited, etc., to achieve the effect of convenient loading and unloading, low thermal conductivity, and uniform furnace temperature

CN106198206AInactive Publication Date: 2016-12-07XIANGTAN UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2016-12-07
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a device and a method for measuring mechanical property of a film under high temperature. The measuring device comprises an optical measurement component, a data processing and displaying component, a dynamic loading component, a heating component and a sample platform, wherein the optical measurement component, the heating component, the sample platform and the dynamic loading component are successively arranged; light sources and light spots sent during measurement are unchanged; due to the bulging effect, the film is deformed; a reflection angle of a light path transmitted to the film is changed due to the deformation of the film; the optical measurement component for receiving a reflected light path is remotely connected to the data processing and displaying component; the received light path is obtained by the optical measurement component; and the data processing and displaying component is used for visually displaying the measurement process and recording the change of the received light path. Through the measuring device, a heating device and a bulging device are combined together to measure the mechanical property of the film under high temperature; the measuring device is compact in structure, is applied to the films of various elasto-plastic systems, and is capable of achieving real-time and full-field measurement of the change of the mechanical property in the heating process.
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Description

technical field

[0001] The invention relates to a full-field measurement device and method for the mechanical behavior of a thin film at high temperature, and belongs to the technical fields of photometric mechanics, structural deformation and mechanical experiments. Background technique

[0002] Thin film refers to the material structure whose thickness direction is much smaller than other directions, and the thickness generally does not exceed 10 μm. Because it is different from the matrix material and has certain strengthening, protection or special functions, it is widely used in micro-nano, microelectronics and materials. In the field of technology, the application of thin film is very extensive. Thin film science and technology is the basis of microelectronics, information, sensors, optics, solar energy utilization and other technologies, and it has widely penetrated into various fields of contemporary science and technology. In order to meet different industrial appl...

Examples

Embodiment Construction

[0051] The present invention will be described in further detail and completely below in conjunction with Examples and Comparative Examples.

[0052] Such as figure 1 The schematic diagram of an embodiment of the device for measuring the high-temperature mechanical properties of thin films of the present invention is shown. The device includes an optical measurement component 1 , a heating component 2 , a power loading component 3 and a data processing and display component 4 . Wherein the optical measurement component 1, the heating component 2, the sample stage 5 and the power loading component 3 are arranged in sequence, in other words, the optical measurement component 1, the heating component 2, the sample stage 3 and the power loading component 3 are arranged in sequence from top to bottom, and the When the sending optical path remains unchanged, the bulging effect causes the film to deform. The optical measurement component 1 is remotely connected to the data processin...