Light-emitting chip bearing structure and manufacturing method thereof
A light-emitting chip and load-carrying structure technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of light-emitting diode chip tilt, thickness instability, etc.
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no. 1 example
[0030] refer to Figure 1 to Figure 6 As shown, the first embodiment of the present invention provides a method for manufacturing a light-emitting chip carrying structure, which includes: first, cooperate with Figure 1 to Figure 3 As shown, a plurality of light-emitting chips 20 are transferred to a circuit substrate 1, so that each light-emitting chip 20 can be electrically connected to the circuit substrate 1 through two initial conductive materials b (step S100); figure 1 , image 3 and Figure 4 As shown, a flat substrate F is driven by a carrying device D1 to simultaneously apply a pressure to a plurality of light-emitting chips 20 (such as Figure 4 shown by the downward arrow), so that the distance D between the multiple light-emitting surfaces 2000 of the multiple light-emitting chips 20 and a top surface 1000 of the circuit substrate 1 is the same (step S102); figure 1 and Figure 5 As shown, while a plurality of light-emitting chips 20 are pressed by the flatten...
no. 2 example
[0037] refer to figure 1 as well as Figure 8 to Figure 14 As shown, the second embodiment of the present invention provides a method for manufacturing a light-emitting chip carrying structure, which includes: first, cooperate with figure 1 and Figure 10 As shown, a plurality of light-emitting chips 20 are transferred to a circuit substrate 1, so that each light-emitting chip 20 can be electrically connected to the circuit substrate 1 through two initial conductive materials b (step S200); figure 1 , Figure 11 and Figure 12 As shown, a flat substrate F (with no adhesive layer) is driven by a carrying device D1 to apply a pressure to a plurality of light-emitting chips 20 at the same time (such as Figure 12 shown by the downward arrow), so that the distance D between the multiple light-emitting surfaces 2000 of the multiple light-emitting chips 20 and a top surface 1000 of the circuit substrate 1 is the same (step S202); figure 1 and Figure 13 As shown, while a plura...
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