Solid fluorescent glue preparation method and solid fluorescent film

Abstract

The invention relates to the technical field of solid fluorescent glue, in particular to a solid fluorescent glue preparation method and a solid fluorescent film. The solid fluorescent glue preparation method comprises the following steps of taking fluorescent powder, silica gel and a diluent, mixing, stirring, carrying out vacuum defoaming, and calculating according to the weight, wherein the ratio of the fluorescent powder to the silica gel to the diluent is (1-5): 1: (0.01-0.2), extruding the defoamed mixed glue solution onto a release film, and flatly pushing and scraping the mixed glue solution to form a mixed glue sheet. Compared with the prior art, the solid fluorescent glue preparation method provided by the invention has the advantages that the silica gel stress and tensile force are completely released by using the diluent after stirring, film scraping, baking and semi-curing cutting, and the original tensile strength of the silica gel is maintained, so that the silica gel has certain flexibility in packaging and use, and when the solid fluorescent glue sheet is attached to a chip, a chip electrode and a metal circuit are not damaged.

Description

technical field [0001] The invention relates to the technical field of solid fluorescent glue, in particular to a preparation method of solid fluorescent glue and a solid fluorescent film. Background technique [0002] As the fourth-generation lighting source, LED light source has significant advantages such as high luminous efficiency, fast response speed, long service life, no toxic gas, no radiation, impact resistance, and easy control compared with previous generations of lighting products. Its application range and The market share is increasing day by day. [0003] However, the existing packaging of light-emitting diodes is generally to package a layer of fluorescent glue or silica gel with phosphor powder on the LED chip; The utilization rate and operability are low; and the existing fluorescent glue or silica gel with fluorescent powder is relatively thick and slow to dissipate heat. And the existing dispensing mostly uses dispensing machines or glue spraying machi...

AI Technical Summary

Problems solved by technology

However, the cost of the existing solid fluorescent film is too high. Usually, nano glass or pure silica gel is added to make solid fluorescent glue. The solid fluorescent glue made of pure silica gel cannot overcome the shrinkage of the glue, and the solid fluorescent glue added with nano glass is determined by the hardness of the material. On the chip surface, the surface of the chip will be damaged during the solid crystal, which will cause damage to the chip motor and circuit wiring and cause the chip to cause leakage

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