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Airtight packaging structure with cavity device

A technology of hermetic packaging and cavity, which is applied in the field of MEMS devices, can solve the problem of high cost and achieve the effect of reducing packaging cost

Pending Publication Date: 2021-12-21
MEMSIC SEMICON WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the cavity packaging of MEMS devices in the prior art is facing the problem of high cost

Method used

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  • Airtight packaging structure with cavity device

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Embodiment Construction

[0008] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0009] Reference herein to "one embodiment" or "an embodiment" refers to a particular feature, structure or characteristic that can be included in at least one implementation of the present invention. "In one embodiment" appearing in different places in this specification does not all refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments. Unless otherwise specified, the words connected, connected, and joined in this document mean that they are electrically connected directly or indirectly.

[0010] Please refer to figure 1 As shown, it is a partial longitudinal sectional view of the hermetic packaging structure of a device with a cavity in an embodiment of the...

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Abstract

The invention provides an airtight packaging structure with a cavity device. The airtight packaging structure comprises a semiconductor component; a cover plate; a bonding layer, which is positioned between the semiconductor component and the cover plate so as to bond the semiconductor component and the cover plate together; a first cavity, which is positioned between the semiconductor component and the cover plate, is surrounded by the bonding layer and is completely sealed; a second cavity, which is located between the semiconductor component and the cover plate, is located on one side of the first cavity, is surrounded by the bonding layer and is partially sealed; a plurality of through holes that penetrate through the cover plate to reach the second cavity; and a sealing film, which is attached to the surface of one side, far away from the semiconductor component, of the cover plate so as to seal the plurality of through holes, so that the second cavity is completely sealed. Compared with the prior art, the packaging of the double cavities with different air pressures can be realized, and the packaging cost can be greatly reduced.

Description

【Technical field】 [0001] The invention belongs to the field of MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) devices, and in particular relates to a hermetic package structure of a device with a cavity, which can package MEMS with different working pressure requirements and / or different gas composition requirements on the same wafer. 【Background technique】 [0002] The movable structure of the micro inertial sensor requires a certain cavity to provide a movable space, and the cavity is usually formed by bonding two or more wafers during the manufacturing process. The existing consumer-grade inertial IMU (Inertial Measurement Uni, Inertial Measurement Unit) processes the accelerometer and the gyroscope on the same wafer, and they have different requirements for the package air pressure. The package air pressure required by the gyroscope is lower than The encapsulation air pressure of the accelerometer, how to realize the encapsulation of different a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81B7/02
CPCB81B7/0035B81B7/0041B81B7/02B81B2201/0235B81B2201/0242
Inventor 凌方舟丁希聪刘尧蒋乐跃
Owner MEMSIC SEMICON WUXI