Method, Apparatus, Equipment and Medium for Predicting Electrical Properties of Wire Bonding Joints

Abstract

Embodiments of the present invention disclose a method, device, equipment and medium for predicting the electrical properties of wire bonding pads. The method includes: receiving a request for predicting the electrical properties of wire bonding pads; obtaining the wire bonding pads The external environment parameters of the point; input the external environment parameters into the pre-trained first neural network model for simulation and calculation, and obtain the parameter information of the wire bonding pads; input the parameter information into the pre-trained The electrical performance prediction is performed in the good second neural network model, and the electrical performance information of the wire bonding pad is obtained. Based on the neural network technology and combined with finite element simulation calculation, the invention realizes accurate analysis and prediction of the electrical performance of the wire bonding solder joints according to the actual environment, provides decision-making basis for lower-level components and control devices, ensures product performance, and improves product performance. accuracy and efficiency of use.

Description

technical field [0001] The invention relates to the technical field of electronic package wire bonding technology, in particular to a method, device, equipment and medium for predicting the electrical performance of wire bonding solder joints. Background technique [0002] Wire bonding has the advantages of low cost, easy process implementation, and wide application range, and has become the most common and widely used method for connecting wires between chips in the electronic packaging process. The quality of the connection point directly determines the performance and reliability of the chip. [0003] In the prior art, since the changes involved in the wire bonding process are extremely complex, and there are subsequent reactions related to working conditions in heterogeneous bonding, non-destructive internal detection cannot be realized only through existing detection methods. In addition, it is impossible to conduct a full-life cycle inspection of the electrical perfor...

AI Technical Summary

Problems solved by technology

[0004] In view of the above technical problems, the embodiments of the present invention provide a method, device, equipment and medium for predicting the electrical properties of wire bonding solder joints, aiming to solve the problem of the inability to rapidly perform electrical performance of wire bonding solder joints in the prior art. detection problem

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