LED device and manufacturing method thereof
A technology for LED devices and manufacturing methods, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of high electroplating cost, low process accuracy and yield, and complex process, so as to improve process accuracy and yield, and avoid copper layers. The effect of inaccurate alignment and improving light output efficiency
Pending Publication Date: 2021-12-28
NINGBO SUNPU OPTO SEMICON
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Problems solved by technology
[0002] At present, when LED (Light-Emitting Diode, light-emitting diode) devices are packaged, copper cups with a certain thickness will be made into copper cups with a certain thickness on the upper surface of the substrate and around the LED chip by multiple electroplating processes. The process is relatively complicated, and each electroplating is carried out on the basis of the previous electroplating copper layer. After multiple electroplating, there will be problems such as offset and burr of the copper layer, and the process precision and yield are low. Electroplating The cost is also high, and the inner wall of the copper cup is perpendicular to the substrate, the light is reflected on the inner wall of the copper cup, and the emitted light is very little. It can basically be considered that there is only one light-emitting surface at the opening of the copper cup, and the light-emitting efficiency of the LED device is relatively high. Low
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[0033] In order to enable those skilled in the art to better understand the solution of the present application, the present application will be further described in detail below in conjunction with the drawings and specific implementation methods. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0034] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed bel...
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The invention discloses a manufacturing method of an LED device. The manufacturing method comprises the following steps: fixing an LED chip on a substrate; covering the surface of the LED chip with a transparent material; and curing the transparent material to form a transparent packaging body to obtain the LED device. According to the manufacturing method of the LED device, after the LED chip is fixed on the substrate, the surface of the LED chip is covered with the transparent material, the transparent material is cured, the transparent packaging body is formed around the LED chip, and a copper cup is prevented from being manufactured in an electroplating mode, so that the problems of inaccurate alignment of a copper layer and the like are solved, the process precision and the yield of the LED device are improved, and the manufacturing cost is reduced. When the LED device emits light, due to the fact that the transparent packaging body is arranged on the periphery of the LED chip, light can be emitted from the four surfaces and the upper surface of the periphery of the LED chip, and the light emitting efficiency of the LED device is improved. In addition, the invention also provides an LED device with the above advantages.
Description
technical field [0001] The present application relates to the field of LED technology, in particular to an LED device and a manufacturing method thereof. Background technique [0002] At present, when LED (Light-Emitting Diode, light-emitting diode) devices are packaged, copper cups with a certain thickness will be made into copper cups with a certain thickness on the upper surface of the substrate and around the LED chip by multiple electroplating processes. The process is relatively complicated, and each electroplating is carried out on the basis of the previous electroplating copper layer. After multiple electroplating, there will be problems such as offset and burr of the copper layer, and the process precision and yield are low. Electroplating The cost is also high, and the inner wall of the copper cup is perpendicular to the substrate, the light is reflected on the inner wall of the copper cup, and the emitted light is very little. It can basically be considered that t...
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IPC IPC(8): H01L33/56
CPCH01L33/56H01L2933/005
Inventor 张耀华杜元宝王国君汤焕张庆豪朱小清
Owner NINGBO SUNPU OPTO SEMICON