Millimeter wave surface-mounted airtight packaging structure and packaging method

Abstract

The invention provides a millimeter wave surface-mounted airtight packaging structure and packaging method, and belongs to the technical field of microwave packaging. The millimeter wave surface-mounted airtight packaging structure comprises a packaging shell, a chip and waveguide cavity reflection structures, wherein the packaging shell comprises a bottom plate, a welding frame and a metal cover plate, and the bottom plate comprises a dielectric plate and grounding plates arranged on the upper surface and the lower surface of the dielectric plate respectively; the chip is arranged on the grounding plate on the upper surface; the waveguide cavity reflection structures are arranged on the grounding plate on the upper surface and are respectively arranged on the left side and the right side of the chip, and the waveguide cavity reflection structures are connected with the chip through microstrip line probes and bonding wires; and the part, which directly faces the grounding plate, of the cavity of each waveguide cavity reflection structure is provided with a window, and the two windows respectively form a radio frequency input port and a radio frequency output port. According to the invention, through structure adjustment, chip airtight packaging can be expanded to a millimeter wave frequency band range, the requirements of packaging precision and airtight packaging can be met, batch production is facilitated, the production efficiency is greatly improved, and the production cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of microwave packaging, and in particular relates to a millimeter-wave surface-mounted hermetic packaging structure and a packaging method. Background technique [0002] With the continuous growth of communication application requirements, the existing spectrum resources are becoming increasingly tight, and the increase in communication capacity also requires a wider operating bandwidth, so the operating frequency is gradually increased to the millimeter wave frequency band. The demand for non-destructive testing in security inspections has promoted the development of terahertz technology, and more and more millimeter-wave frequency band chips are widely used. Since bare chips cannot be directly used for design in most scenarios, conventional applications are to encapsulate bare chips in plastic or use metal or ceramic hermetic packaging. [0003] Microwave circuits with a frequency lower than 30GHz already...

AI Technical Summary

Problems solved by technology

The disadvantage of these structures is that the structure is complex and the cost is high; or due to the large parasitic parameters, the transmission loss in the millimeter wave band is large, the performance is seriously degraded, and it is even unusable.

As a result, it is difficult to popularize these structural packages in chip applications with frequencies higher than 40 GHz

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