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Cooling fin assembling device for semiconductor production

A technology for assembling devices and heat sinks, which is applied in the direction of material gluing, connecting components, hand-held tools, etc., can solve the problems of reducing the assembly efficiency of semiconductors and heat sinks, and achieve the effects of convenient adhesion, improved efficiency, and convenient adsorption

Active Publication Date: 2022-01-11
中科晟(重庆)测控技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]In order to ensure the normal and efficient operation of semiconductors, heat sinks are assembled during the production process of semiconductors. At present, the widely used method for assembling semiconductors and heat sinks is Manually, greatly reducing the assembly efficiency of semiconductors and heat sinks

Method used

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  • Cooling fin assembling device for semiconductor production
  • Cooling fin assembling device for semiconductor production
  • Cooling fin assembling device for semiconductor production

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0024] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0025] refer to Figure ...

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Abstract

The invention discloses a cooling fin assembling device for semiconductor production. The cooling fin assembling device comprises a first conveying plate, a second conveying plate and a material storage box, an inclined plate is fixed to the end portion of the first conveying plate, a reciprocating mechanism and a guide rod are arranged on the upper side of the first conveying plate, the end portion of the guide rod is slidably sleeved with a sliding plate, and a telescopic rod is fixed to the outer wall of the sliding plate. A suction mechanism is vertically and downwards fixed to the driving end of the telescopic rod, a change-over switch is installed on the upper side of the first conveying plate, a lifting plate is arranged in the material storage box in a sliding mode, a lifting spring is fixed between the lower side wall of the lifting plate and the inner bottom wall of the material storage box, and cooling fins are placed on the upper side of the lifting plate. According to the cooling fin assembling device, the assembly work of a semiconductor and the cooling fins is achieved by sucking the cooling fins and driving the cooling fins to move downwards to make contact with and press the semiconductor dripped with glue, the continuous assembly work is achieved through the reciprocating motion of the sliding plate, and the assembly efficiency of the semiconductor and the cooling fins is greatly improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor production, in particular to a heat sink assembly device for semiconductor production. Background technique [0002] A semiconductor refers to a material whose conductivity at room temperature is between that of a conductor and an insulator. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. Semiconductor devices use the special electrical characteristics of semiconductor materials to complete electronic devices with specific functions, which can be used to generate, control, receive, Transform, amplify signals, and perform energy conversions. The semiconductor material of semiconductor devices is silicon, germanium or gallium arsenide, which can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. [0003] In order to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B25B27/02F16B11/00
CPCB25B27/02F16B11/006
Inventor 张浩
Owner 中科晟(重庆)测控技术有限公司
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