Automatic wafer positioning assembly

Abstract

The invention provides an automatic wafer positioning assembly which is used for positioning a wafer for wet processing. The automatic wafer positioning assembly comprises a Bernoulli rotary disc, a plurality of positioning devices and a control part. When the Bernoulli rotary disc does not generate the air cushion and the control part enables the plurality of positioning devices to be in an open state, the wafer can be placed on the Bernoulli rotary disc or taken out from the Bernoulli rotary disc. When the Bernoulli rotary disc generates an air cushion and the control part enables the plurality of positioning devices to be in a closed state, the wafer is suspended and rotated above the Bernoulli rotary disc for wet processing.

Description

【Technical field】 [0001] The disclosure relates to a positioning assembly, in particular to an automatic wafer positioning assembly. 【Background technique】 [0002] In the prior art, when it is desired to carry out wet processes such as etching and cleaning for thinned or warped wafers, in the case where a vacuum suction turntable cannot be used for processing, in order to prevent spraying on the processing surface of the wafer (such as : upward) the chemical solution overflows to the protective surface of the wafer (for example: downward), and the processing purposes such as etching and cleaning will be achieved by using a Bernoulli Chuck. [0003] Bernoulli's Principle, which is used in Bernoulli's turntable, its establishment mechanism is to place the wafer above the Bernoulli turntable, and then introduce airflow between the bottom of the wafer and the Bernoulli turntable to form Air cushion and create negative pressure at the same time. At this time, through proper ai...

AI Technical Summary

Problems solved by technology

[0004] Since the airflow introduced between the bottom of the wafer and the Bernoulli turntable may generate uneven airflow distribution in an instant, the wafer rotating at high speed at this time may move radially due to the uneven airflow distribution, and then deviate from the Wafer slippage may occur at the center of the Bernoulli turntable, seriously affecting the progress of subsequent processes

[0005] In view of this, how to provide an automatic wafer positioning assembly to perform positioning during wafer rotation, to avoid radial movement of high-speed rotating wafers due to uneven air distribution, thereby deviating from the center point of the Bernoulli turntable or The phenomenon of wafer slippage is an urgent problem in this industry

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