Packaging structure and preparation method thereof

Abstract

The invention provides a packaging structure and a preparation method thereof. The packaging structure comprises a main circuit board, an antenna board and at least two main function chips electrically connected with the main circuit board, wherein the at least two main function chips are arranged on the front surface of the main circuit board at intervals, the antenna board is connected to one sides, far away from the main circuit board, of the two main function chips which are arranged at intervals, the packaging structure further comprises a heat dissipation cover connected to the sides, away from the main circuit board, of the at least two main function chips, and the heat dissipation cover is provided with a containing cavity used for containing the antenna board. According to the invention, the at least two main function chips do not occupy the space of the back surface of the main circuit board so as to reduce the plane size of the packaging structure and conveniently connect the heat dissipation cover with the main function chips, in other words, a corresponding heat dissipation structure used for heat dissipation of the main function chips is conveniently designed, and the structure is simple.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a packaging structure and a preparation method that is beneficial to the heat dissipation of a main function chip. Background technique [0002] In recent years, with the advent of the 5G high-speed communication era, antenna transmission in the millimeter wave band will become the mainstream transmission technology in the 5G era. Millimeter wave band transmission is not suitable for long-distance transmission. The longer the path, the greater the signal attenuation. The newer Aip The technology is an integrated structure of IC+packaged antenna, which can achieve high gain through antenna array. [0003] At the same time, the wavelength of the millimeter-wave frequency band is extremely short, requiring higher processing accuracy to meet the requirements of stable electrical performance. Any error in processing accuracy may lead to impedance mismatch and signal reflection. ...

AI Technical Summary

Problems solved by technology

However, the heat dissipation scheme of the chip in this double-substrate package structure has higher requirements on the main circuit board, and the heat dissipation connection between the chip and the main circuit board is affected by the height and distribution of the solder balls on the lower side of the main circuit board. The multiple effects of multiple influences, the technical difficulty is relatively high, and the cost is high. At the same time, the relative volume of this double-substrate packaging structure is relatively large

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