12results about How to "Reduce plane size" patented technology

The invention discloses an intelligent bridge shock isolation device with a replaceable sensor and an installation method.The device comprises a connecting module, the connecting module comprises a support bottom connecting plate (7) and a sliding module arranged at the top of the support bottom connecting plate (7), and the sliding module comprises an upper friction plate (1), a lower friction plate (4) and an arc-shaped sliding block (3); the data measurement module comprises a sensing force holding layer (5) arranged at the bottom of the lower friction plate (4), the sensing force holding layer (5) is provided with a sensor module (8), and the replacement module comprises a sensor assembly layer (6), an internal wedge block (9) and an external wedge block (10). A sliding friction pair is jointly formed by the connecting module and the sliding module, so that the good damping performance of the support is achieved, meanwhile, the stress state of a bridge is monitored in real time through the data measuring module, intelligent monitoring and jacking installation and rapid replacement of the sensor module are achieved, and the problem that a traditional bridge support cannot be rapidly and safely replaced is solved.

The invention discloses an isolator circuit structure of a high-level inter-level isolation double-junction microstrip circulator, belongs to the field of microwave devices, and aims to shorten the length of an inductor and change the capacitance matched with the inductor, so that the plane size of a product can be effectively reduced; a three-section matching stub line interstage circuit structure design compensates the length of a connecting line between two loop junctions, so that the interstage isolation degree of the double-junction microstrip circulator isolator can be effectively improved; by combining the two designs, the interstage isolation degree of the double-junction microstrip circulator isolator is improved by more than 3dB under the condition that the size is not changed or reduced.

The invention provides a CD-ROM integrated laminated packaging structure, a preparation method thereof and a lamp panel, the laminated packaging structure comprises a packaging carrier plate, an LED chip and a driving chip, the packaging carrier plate comprises a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer which are stacked in sequence; the LED chip is arranged on one side, deviating from the first insulating layer, of the first metal layer, and the LED chip is electrically connected with the third metal layer through the first metal layer; the driving chip is arranged on one side, deviating from the first insulating layer, of the second metal layer, and the driving chip is electrically connected with the third metal layer through the second metal layer; wherein the third metal layer is used for being electrically connected with the printed circuit board. According to the LED lamp panel, the number of partitions of the lamp panel can be increased, a finer picture effect is achieved, meanwhile, the driving circuit is transferred into the packaging carrier plate, the plane wiring difficulty of the printed circuit board is effectively reduced, the length difference of the driving circuit between the driving chip and the LED chip is improved, and the light emitting quality is improved.

This invention belongs to the field of microwave communication technology, specifically relating to a PIFA antenna for 5G dual-band coverage. The invention includes a rectangular metal patch on a top surface, a substrate, and a metal ground plane stacked from top to bottom. A row of grounding vias is disposed through the substrate, and this array of grounding vias is located at the lower end of one side of the rectangular metal patch on the top surface. A coaxial feeding structure is disposed below the rectangular metal patch on the top surface. The antenna excites its fundamental mode TM through the coaxial feeding structure. 0.5,0 Mode and three higher-order modes TM 0.5,1 Pattern, TM 0.5,2 Pattern, and TM 0.5,3 The pattern includes a rectangular metal patch on the upper surface with a first slot along its vertical center line; the first slot has an opening on the side furthest from the grounding via for adjusting the TM. 0.5,1 Pattern and TM 0.5,3 The resonant frequency of the mode; a pair of second slits are orthogonally arranged on both sides of the first slit; the second slits are used to modulate the TM. 0.5,0 Pattern and TM 0.5,2 The resonant frequency of the mode. The antenna design proposed in this invention has advantages such as simple structure, relatively wide dual-band coverage, small size, and low profile.

The invention discloses a filter and an electronic device, and the filter comprises an element body which is formed by stacking one or more dielectric layers along a stacking direction; the multi-layer resonators comprise a first multi-layer resonator, a second multi-layer resonator and a third multi-layer resonator, and each multi-layer resonator comprises a first conductor structure, a second conductor structure, a third conductor structure and two path conductors; a first signal transmission end and a second signal transmission end, the first signal transmission end is coupled with the first multilayer resonator, and the second signal transmission end is coupled with the second multilayer resonator; and a coupling capacitive structure formed by coupling metalized electrodes formed inside the element body or on the surface of the element body, the coupling capacitive structure being disposed on a coupling path between the first multilayer resonator and the second multilayer resonator. The first multi-layer resonator is coupled with the second multi-layer resonator, and the third multi-layer resonator is simultaneously coupled with the first multi-layer resonator and the second multi-layer resonator.

This invention provides a highly integrated underground pressure regulating device, belonging to the field of gas pressure regulating boxes, comprising a ventilation venting signal tower and an underground pressure regulating box. The ventilation venting signal tower is connected to the underground pressure regulating box via a pipeline assembly. The underground pressure regulating box includes a box body and two integrated pressure regulating devices. The box body has two receiving cavities, each containing one integrated pressure regulating device. One side of the box body is connected to a main inlet pipe and a secondary inlet pipe, and the other side of the box body is connected to a main outlet pipe and a secondary outlet pipe. The main inlet pipe, one of the receiving cavities, and the main outlet pipe are connected; the secondary inlet pipe, the other receiving cavity, and the secondary outlet pipe are connected. An inlet valve is installed on each of the main and secondary inlet pipes, and an outlet valve is installed on each of the main and secondary outlet pipes. The purpose is to solve the problem of the large footprint of underground pressure regulating devices. The achieved technical effect is a reduction in the footprint.

The invention discloses a chip packaging structure. The chip packaging structure comprises a circuit substrate, a pin support, a first chip, a second chip, a connecting piece and a packaging body. The pin support is stacked on the circuit substrate, and the pin support is bent to form an accommodating space. The first chip is arranged on the pin support and located in the containing space. The second chip is arranged on the circuit substrate and located in the containing space. The connecting piece is connected with the pin support and the circuit substrate. The packaging body is arranged on the circuit substrate and wraps the first chip, the second chip and the pin support. Therefore, according to the invention, the pin support and the circuit substrate are vertically integrated, stacked and packaged, and different chips are arranged on different carriers, so that the plane size of the whole structure is effectively reduced, the difficulty of arranging circuit wiring on the circuit substrate is reduced, and the whole heat dissipation efficiency is improved.

The utility model relates to the field of chip packaging, in particular to a short-wave infrared detector, which comprises a ceramic tube shell, an optical window, a tube shell metal ring, a short-wave infrared chip and a refrigerator, the tube shell metal ring is arranged at the opening of the cavity of the ceramic tube shell to increase the height of the cavity; the optical window covers the opening of the cavity, and forms a closed working cavity with the ceramic tube shell and the tube shell metal ring; the refrigerator is arranged at the bottom of the closed working cavity, and the short wave infrared chip is arranged in the closed working cavity and located at the top of the refrigerator. According to the utility model, the ceramic tube shell with smaller insulator spacing is used, and a section of tube shell metal ring is additionally arranged at the opening of the cavity of the ceramic tube shell, so that the height of the cavity is increased, the packaging of a stacked structure formed by the short-wave infrared chip and the refrigerator is realized, the problem of low yield is avoided, and the production efficiency is improved. And the universality of the short-wave infrared detector is improved.

This invention discloses a miniaturized balanced-single-ended 180° hybrid coupler, belonging to the field of radio frequency and microwave technology. It includes: a stacked dielectric substrate, and a differential-end balanced feed unit, a symmetrical short-circuit stepped impedance ring, a center-loaded short-circuit stub, a sum-end balanced feed group, a first single-port, and a second single-port, all disposed within the dielectric substrate. The differential-end balanced feed unit and the symmetrical short-circuit stepped impedance ring are connected by a short circuit at one half to form two sets of wide-side coupled striplines, creating an anti-phase coupled transmission path. The sum-end balanced feed group and the center-loaded short-circuit stub at the symmetrical midpoint of the symmetrical short-circuit stepped impedance ring form a three-wire coupling, creating an in-phase coupled transmission path. The first and second single-ports are connected to two impedance transformation nodes of the symmetrical short-circuit stepped impedance ring for input / output of equal-amplitude in-phase or equal-amplitude out-of-phase single-ended signals. This invention integrates balanced-single-ended conversion, broadband filtering, high common-mode rejection, and compact packaging into a single unit.

This utility model relates to the field of electromagnetic wave conduction technology, and in particular to a conductor, a strip wire, and a power combining device. The conductor includes a branch conductor connected to a main conductor. The main conductor has a height of H1 and a width of W1. The branch conductor has a height of H2 and a width of W2, where H1 > W1 and H2 > W2. This provides a conductor with a smaller planar size, which is beneficial for device miniaturization. The strip wire uses the conductor, and the power combining device uses the strip wire.

The utility model discloses an improved floating plate upper -placed formula slab shear hinge, this shear hinge includes the embedded sleeve pipe in the floating plate, installs the stud in this embedded sleeve pipe, the upper surface of low side's floating plate places the height -adjusting base plate, and the height -adjusting base plate or the floating plate is provided with the buffer pad and the shear plate, and the shear plate, buffer pad, height -adjusting base plate realize the fixed through the double -layer single -cut groove self -locking nut and flat washer of stud top. Wherein, be provided with stiffened plate on shear plate, and through the optimization shear hinge stud's layout position solved the uneven problem of existing shear hinge stud stress. Through the optimization shear plate shape, reduced the thickness of shear plate, saved the use of material, embedded steel sleeve pipe bottom 2 layer bottom plate for increasing the pullout resistance of embedded steel sleeve pipe. The stud only sets up the screw thread in the lower part, is used for the axial force that the stud received is transmitted to the inside of floating plate, reduces the stress level of floating plate surface concrete to reduce or avoid the damage of the board body.

The invention discloses a finite element modeling and thickness design method for an additional paving structure of an airport cement concrete pavement. The thickness design method comprises the following steps: investigating and collecting pavement conditions and structural parameters of the existing cement concrete pavement, and performing thickness reduction on an old concrete pavement layer according to the existing pavement conditions; modeling a three-dimensional finite element structure of the pavement structure; dividing road surface strips and calculating the accumulated fatigue damage of the overlay layer of the airplane on each strip; determining the design thickness of the additional paving layer according to the maximum accumulated fatigue damage in each strip; checking the minimum paving thickness and the like. According to the method, the simplified three-dimensional finite element model is provided on the premise that the calculation result is converged and stable, the model calculation time is shortened, meanwhile, the influence of the existing pavement condition on the additional layer is considered, and the lateral offset of the airplane is considered in the calculation of the accumulated action times, so that the additional layer thickness design method is more scientific and reasonable.