Manufacturing method of high-density arbitrary interconnection type packaging carrier plate with embedded copper block design

Abstract

The invention provides a manufacturing method of a high-density arbitrary interconnection type packaging carrier plate with an embedded copper block design. The manufacturing method comprises the following steps: 1, providing an inner layer plate; 2, routing a stepped groove, wherein the stepped groove is routed on the inner layer plate and penetrates through the whole inner layer plate; 3, placing the copper block in the stepped groove; and 4, fixing the copper block, injecting resin into gaps around the copper block in a vacuum state to completely fill the gaps between the copper block and the stepped grooves with the resin, and then curing the resin at high temperature; and 5, pressing an outer layer plate, namely pressing the outer layer plate on the inner layer plate through the resin. According to the invention, high-density arbitrary interconnection processing between the inner layer board and the outer layer board of the product can be realized, the flexibility of circuit layout between the copper layers is improved, the practicability is strong, and the method has strong popularization significance.

Description

technical field [0001] The invention relates to a circuit board molding process, in particular to a method for manufacturing a high-density arbitrary interconnection type package carrier board designed with buried copper blocks. Background technique [0002] Printed circuit boards, referred to as printed boards or circuit boards, are one of the important components of the electronics industry. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed boards are used for the electrical interconnection between them. . [0003] For one type of circuit board, due to heat dissipation or conductivity requirements, it is necessary to embed copper blocks in the circuit board. The traditional processing method of embedded copper block products uses hot pressing and melting prepreg to fill the g...

AI Technical Summary

Problems solved by technology

[0003] For one type of circuit board, due to heat dissipation or conductivity requirements, it is necessary to embed copper blocks in the circuit board. The traditional processing method of embedded copper block products uses hot pressing and melting prepreg to fill the gap between the copper block and the printed circuit board. At least two copper-clad laminates must be used for auxiliary positioning. Due to the addition of two copper-clad laminates, the traditional buried copper block processing method cannot meet the high-density arbitrary interconnection of the product at the same time when the outer layer is pressed.

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