Forming die of paper carrier tape and forming process thereof

Abstract

The invention discloses a forming die of a paper carrier tape and a forming process thereof. The forming die comprises an upper die assembly and a lower die assembly, the upper die assembly comprises an upper cover plate, an upper die base, an upper cushion plate and an upper clamping plate which are fixedly connected through screws from top to bottom, a stripper plate is movably connected with the upper die assembly above the stripper plate through equal-height sleeves, a stripping insert core for positioning is embedded in the stripper plate, a flattening insert core is vertically arranged in the stripping insert core, a punching punch is hung on the upper clamping plate and penetrates through the flattening insert core, the flattening insert core adopts a round piece with the diameter of 2.50 mm, and a flattening convex block with the diameter of 0.39 mm is downwards arranged at the bottom of the flattening insert core. By means of the mode, the concentricity of the cavity and the bottom hole is guaranteed, PG is used for machining a tool edge and a punch, the machining precision is high, the quality of a punched paper carrier tape is good, the service life of parts is long, waste discharge is smooth, and holes are not prone to being blocked.

Description

technical field [0001] The invention relates to the technical field of carrier tape forming, in particular to a forming mold of a paper carrier tape and a process thereof. Background technique [0002] For precision electronic components such as resistors, capacitors, transistors, diodes, and shrapnel for mobile phones, static electricity may be generated due to friction during packaging and transportation, resulting in excessive adsorption of products due to static electricity during assembly, resulting in Therefore, PS carrier tape or paper carrier tape is used as the product packaging material, and it is used together with the cover tape. The insulating material of the carrier tape can effectively prevent the generation of static electricity, and can also ensure that electronic components are not polluted and damaged during transportation; However, for the products with smaller shape and thinner thickness, paper carrier tape is usually preferred for packaging. Compared wi...

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Problems solved by technology

[0002] For precision electronic components such as resistors, capacitors, transistors, diodes, and shrapnel for mobile phones, static electricity may be generated due to friction during packaging and transportation, resulting in excessive adsorption of products due to static electricity during assembly, resulting in Therefore, PS carrier tape or paper carrier tape is used as the product packaging material, and it is used together with the cover tape. The insulating material of the carrier tape can effectively prevent the generation of static electricity, and can also ensure that electronic components are not polluted and damaged during transportation; However, for the products with smaller shape and thinner thickness, paper carrier tape is usually preferred for packaging. Compared with PS carrier tape, it has the advantages that it is not easy to throw materials and the product is not easy to jump out of the cavity, because PS carrier tape The belt is molded by heating and blow molding, and there is an R angle at the bottom of the cavity, which can easily cause thinner products to be thrown and jump out of the cavity, resulting in the inability to position the assembly section for use

[0003] Usually, the paper carrier tape is punched by the cylinder, the continuity of the cylinder is poor, and the production efficiency is low. For the circular gasket with small diameter and thin thickness, the exhaust gas needs to be punched out at the bottom of the paper carrier tape cavity. The diameter of the hole is only 0.1~0.15mm, and the concentricity between the small hole and the cavity must be ensured. The cavity must also be formed by a thinning process before the product can be loaded.

[0004] The mold test plan and corresponding parameters of the paper carrier tape are as follows. Plan 1: flatten first, then punch ∅0.17 small hole forming process. The concentricity of flattening and punching cannot be guaranteed during the production process of this forming process; Plan 2: punch ∅ first 0.14 small hole, followed by flattening forming process. In the production process of this forming process, the ∅0.15 small hole is formed and the shape of the round hole is irregular after flattening, and the concentricity of flattening and punching cannot be guaranteed; Option 3: by punching Flattening and punching synchronous forming process. This forming process is optimized by Scheme 1 and 2. During the production process of the forming process, the product is flattened and punched.

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