Low-loss power module with novel heat dissipation mode

Abstract

The invention discloses a low-loss power module with a novel heat dissipation mode. The invention aims to solve the problems that an existing high-power active reactive power compensation device is tedious in internal structure layout, large in size and poor in heat dissipation effect. According to the low-loss power module, a box body, a front panel, a rear panel, a radiator, a cover plate, a first supporting plate, a second supporting plate, a third supporting plate, a fan and supporting plate fixing pieces are adopted; the box body, the front panel, the rear panel and the cover plate form a rectangular box; the supporting plate fixing pieces are fixed to the inner wall of the box body; the first supporting plate, the second supporting plate and the third supporting plate are fixed in the box body through the supporting plate fixing pieces and are all parallel to the bottom of the box body; the fan and the radiator are installed at the bottom of the box body; and a flow guide plate is installed at an air outlet of the fan. According to the low-loss power module with the novel heat dissipation mode, a high-power modularized active SVG is minimized under the condition that heat dissipation is guaranteed through a functional layered design, and on-site construction and installation are facilitated.

Description

technical field [0001] The invention relates to the technical field of active reactive power compensation, in particular to a low-loss power module with a novel heat dissipation method. Background technique [0002] Active reactive power compensation refers to a device that uses a self-commutated bridge circuit composed of fully-controlled high-power power electronic devices IGBT to perform reactive power compensation. After the reactor is connected in parallel to the power grid, the phase and amplitude of the output voltage of the AC side of the bridge circuit are properly adjusted, or the current of the AC side is directly controlled, so that the circuit absorbs or emits reactive power that meets the requirements, and realizes dynamic reactive power compensation. the goal of. At present, high-power active and reactive power compensation devices have a large volume, and their internal structure design is complicated, and the functional lines are messy, which interferes wit...

AI Technical Summary

Problems solved by technology

[0004] The invention mainly solves the problems of the existing high-power active reactive power compensation device with redundant internal structure layout, large volume and poor heat dissipation effect; it provides a low-loss power module with a new heat dissipation method

Images