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Silver dispensing device for lead frame processing

A technology of lead frame and spotting silver, which is applied to devices, coatings, electrical components, etc. for coating liquid on the surface. The effect of safety and convenience

Pending Publication Date: 2022-02-08
TAIZHOU YOURUN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the existing silver pointing devices used for lead frame processing, during use, the silver point falls on the table and needs to be collected manually, which is extremely troublesome. Moreover, the silver point generally falls below the action mechanism and needs to be manually collected. safety hazard

Method used

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  • Silver dispensing device for lead frame processing
  • Silver dispensing device for lead frame processing
  • Silver dispensing device for lead frame processing

Examples

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. The specific embodiments described here are only used to explain the present invention, not to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] The present invention provides such Figure 1-7 The shown silver pointing device for lead frame processing includes a silver pointing device body 1 and a collection assembly 4. The collection assembly 4 is used to collect silver points under the surface action mechanism of the workbench 101. The silver pointing device...

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Abstract

The invention discloses a silver dispensing device for lead frame processing. The silver dispensing device comprises a silver dispensing device body and a collection assembly, wherein the silver dispensing device body comprises a workbench, a fixing plate is slidably mounted on one side of the top of the workbench, a transmission assembly is mounted on one side, close to the fixing plate, of the top of the workbench, one side of the transmission assembly is in transmission connection with one side of the fixing plate, the collection assembly comprises a suction cover and a collection barrel, the suction cover is installed on the fixing plate, one end of the suction cover is communicated with a hose, one end of the hose is communicated with one side of the collection barrel, the collection barrel comprises a barrel body and a barrel cover, and an electric motor is fixedly mounted on the inner side of the barrel cover. According to the invention, a collection mechanism is additionally arranged on the structure of the silver dispensing device, and in the process of using the silver dispensing device, the collection mechanism is used for collecting the silver points below an action mechanism on a table top, so that the collection of the silver points is more convenient and safer.

Description

technical field [0001] The invention belongs to the technical field of lead frame processing, and in particular relates to a silver spotting device for lead frame processing. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. During lead frame processing, a spot silver device is used. [0003] Most of the existing silver pointing devices used for lead frame processing, during use, the silver point falls on the table and needs to be collected manually, which is extremely troublesome. Moreover, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C11/10B05C11/11H01L21/67
CPCB05C11/1039B05C11/11H01L21/6715H01L21/67138H01L21/67144
Inventor 张轩
Owner TAIZHOU YOURUN ELECTRONICS
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