Integrated circuit manufacturing process practical training system construction method based on Unity 3D technology

Abstract

The invention provides an integrated circuit manufacturing process practical training system construction method based on a Unity 3D technology, and the method comprises the following steps: S1, carrying out the manufacturing detection of a wafer, forming an integrated circuit through a plurality of processes after the detection, and testing the integrated circuit; S2, after the test is completed, establishing a single-sided model by adopting a three-dimensional software 3DSmax polygon modeling method; S3, displaying corresponding contents in the whole scene by using a FirstPersonController in Unity 3D, making an experiment entrance of each process, and carrying out an experiment on each process; and S4, after the experiment is completed, according to the operation condition of each experiment step in the experiment process, displaying the result on an ending interface. According to the invention, the problem that high-reduction-degree practical training and assessment are difficult to carry out due to the fact that the integrated circuit manufacturing process is limited by equipment, sites, safety, specialty and the like can be solved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit process construction, in particular to a method for constructing an integrated circuit manufacturing process training system based on Unity 3D technology. Background technique [0002] Integrated circuit related courses are highly practical, engineering, and technical, which requires not only the teaching of conventional and traditional classroom theoretical knowledge, but also a large number of supplementary experimental and practical courses in the teaching process. But for the integrated circuit industry, there are many difficulties in practical teaching or training. On the one hand, the integrated circuit manufacturing process involves a lot of equipment, large size, and high price, and has high requirements on the area and environment of the production site. Round detection requires a thousand-level dust-free workshop; on the other hand, the corresponding equipment and workshop mai...

AI Technical Summary

Problems solved by technology

[0014] Aiming at the deficiencies in the existing technology, the purpose of the present invention is to provide a method for constructing an integrated circuit manufacturing process training system based on Unity 3D technology, which can solve the problem that the integrated circuit manufacturing process is difficult to carry out high-level reduction due to limitations of equipment, venues, safety, professionalism, etc. Questions about degree training and assessment

Images