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A vertical probe card device and its detection method

A technology of probe cards and probes, which is applied in the direction of measuring devices, measuring electricity, and measuring electrical variables, etc., can solve problems such as probe contact, deformation offset, etc., and achieve improved service life, good contact, and clear needle marks Effect

Active Publication Date: 2022-04-26
FTDEVICE TECH (SUZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] The present invention overcomes the deficiencies of the above-mentioned prior art, and provides a vertical probe card device and its detection method, which are used to solve the existing deformation and offset problems, probe contact problems and probe replacement and repair problems

Method used

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  • A vertical probe card device and its detection method
  • A vertical probe card device and its detection method
  • A vertical probe card device and its detection method

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0052] This embodiment is an embodiment of a vertical probe card device.

[0053] Such as Figure 1-10 As shown, a vertical probe card device disclosed in this embodiment includes an upper guide plate 1, a middle guide plate 2, a lower guide plate 3, a deformation connection device 4, a first probe 5, a second probe 6, a circuit board 7, The first welding pad 8; the upper guide plate 1, the middle guide plate 2 and the lower guide plate 3 are respectively provided with a plurality of vertical limit through holes, and a plurality of deformation connection devices are arranged in an array between the upper guide plate 1 and the middle guide plate 2 4. One end of the plurality of first probes 5 passes through the vertical limiting through hole of the upper guide plate 1 and is electrically connected to one end of the corresponding deformation connection device 4, and the other end is connected to the corresponding first solder joint on the circuit board 7. Pads 8 are connected, ...

specific Embodiment approach 2

[0086] This embodiment is an embodiment of a vertical probe card device.

[0087] A test parameter setting method for a vertical probe card device disclosed in this embodiment includes the following steps:

[0088] Step a, assumed length,

[0089] First assemble some vertical probe card devices to be tested. During the assembly process, the length of the elastic pins 4-7 arrayed on the side wall of the stabilizer 4-4 will be adjusted through the screw thread, and the effective length of the elastic pins 4-7 will be adjusted. , and the effective length of the elastic pins 4-7 is preliminarily set as S, and then the vertical probe card device is assembled;

[0090] Step b. Plane test

[0091] The assembled vertical probe card to be tested is installed on the bearing platform of the test probe station, and the contact flatness test is carried out one by one, and the difference between the highest point and the lowest point of the second probe 6 tip on the vertical probe card is...

specific Embodiment approach 3

[0112] This embodiment is an embodiment of a vertical probe card device.

[0113] A method for calculating the displacement of a probe of a vertical probe card device, comprising the following steps:

[0114] Step a, measure elastic modulus E and moment of inertia I of elastic needle 4-7;

[0115] Step b. Force analysis calculates the concentrated load acting on one end of the elastic needle 4-7 by the limiting member 4-1 through the limiting bead 4-3. When the number of elastic needles is n, calculate the concentrated load acting on the elastic needle 4. The concentrated load of the spacer beads 4-3 at one end of -7 is

[0116] Step c. Draw concentrated load The bending moment diagram when acting on the limit bead 4-3 and on the elastic pin 4-7, that is, M P picture;

[0117] Step d. Draw the unit load The bending moment diagram when acting on the limit bead 4-3 and on the elastic pin 4-7, that is, M 1 picture;

[0118] Step e, calculate the longitudinal displaceme...

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Abstract

The invention relates to a vertical probe card device and a detection method thereof, which relate to the technical field of probe cards; the vertical probe card device includes an upper guide plate, a middle guide plate, a lower guide plate, a deformation connection device, a first probe, and a second probe , the circuit board and the first welding pad; the upper guide plate, the middle guide plate and the lower guide plate are respectively provided with a plurality of vertical limit through holes, and the array between the upper guide plate and the middle guide plate is provided with a plurality of deformation connection devices, and the plurality of the first One end of a probe passes through the vertical limit through hole of the upper guide plate and is electrically connected to one end of the corresponding deformation connection device; Push forward and closed-circuit test steps; the vertical probe card device of the present invention and its detection method solve the problem of deformation and offset of the existing probe, the contact problem of the probe and the replacement and repair problem of the probe, so as to achieve good contact and no needle marks. Clear, effective use of effects.

Description

technical field [0001] The invention relates to a vertical probe card device and a detection method thereof, which relate to the technical field of probe cards. Background technique [0002] The generation of a chip mainly needs to go through four major links: design, manufacturing, packaging, and testing. After the wafer manufacturing is completed, it is necessary to test the freshly released wafer. In this link, the electrical performance of each chip will be tested. , wafer inspection has two main purposes: [0003] First, identify qualified chips to enter the packaging process, saving unnecessary packaging costs; [0004] Second, evaluate the electrical parameters of the circuit to maintain the quality level of the process. [0005] A very important consumable in wafer testing - probe card, probe card is mainly used in wafer testing, it is the medium between wafer and electronic testing system in wafer testing, engineering verification before mass production of chips ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/067G01R1/073
CPCG01R1/067G01R1/073
Inventor 王强金永斌贺涛丁宁朱伟
Owner FTDEVICE TECH (SUZHOU) CO LTD
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