A vertical probe card device and its detection method

A technology of probe cards and probes, which is applied in the direction of measuring devices, measuring electricity, and measuring electrical variables, etc., can solve problems such as probe contact, deformation offset, etc., and achieve improved service life, good contact, and clear needle marks Effect
CN114034894BActive Publication Date: 2022-04-26FTDEVICE TECH (SUZHOU) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
FTDEVICE TECH (SUZHOU) CO LTD
Publication Date
2022-04-26

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Abstract

The invention relates to a vertical probe card device and a detection method thereof, which relate to the technical field of probe cards; the vertical probe card device includes an upper guide plate, a middle guide plate, a lower guide plate, a deformation connection device, a first probe, and a second probe , the circuit board and the first welding pad; the upper guide plate, the middle guide plate and the lower guide plate are respectively provided with a plurality of vertical limit through holes, and the array between the upper guide plate and the middle guide plate is provided with a plurality of deformation connection devices, and the plurality of the first One end of a probe passes through the vertical limit through hole of the upper guide plate and is electrically connected to one end of the corresponding deformation connection device; Push forward and closed-circuit test steps; the vertical probe card device of the present invention and its detection method solve the problem of deformation and offset of the existing probe, the contact problem of the probe and the replacement and repair problem of the probe, so as to achieve good contact and no needle marks. Clear, effective use of effects.
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Description

technical field

[0001] The invention relates to a vertical probe card device and a detection method thereof, which relate to the technical field of probe cards. Background technique

[0002] The generation of a chip mainly needs to go through four major links: design, manufacturing, packaging, and testing. After the wafer manufacturing is completed, it is necessary to test the freshly released wafer. In this link, the electrical performance of each chip will be tested. , wafer inspection has two main purposes:

[0003] First, identify qualified chips to enter the packaging process, saving unnecessary packaging costs;

[0004] Second, evaluate the electrical parameters of the circuit to maintain the quality level of the process.

[0005] A very important consumable in wafer testing - probe card, probe card is mainly used in wafer testing, it is the medium between wafer and electronic testing system in wafer testing, engineering verification before mass production of chips ...

Claims

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