Method for assembling, repairing and setting test parameters of vertical probe card device

Abstract

The invention discloses a method for assembling, repairing and setting test parameters of a vertical probe card device, and relates to the technical field of probe cards. The assembling method sequentially executes the steps of needle connecting, distance adjusting, piece hanging, plate penetrating, fixing and electric connecting. The repairing method comprises the steps of overall dismounting, fixed mounting, dismounting and separating, probe replacing, probe repairing and reassembling in sequence. The test parameter setting method sequentially executes the steps of length assuming, plane testing, contact pressure calculation, deformation calculation, height setting and effective length calculation. According to the method for assembling, repairing and setting the test parameters of the vertical probe card device, the problems of assembling, repairing and test parameter setting of a vertical probe card with an upper guide plate, a middle guide plate, a lower guide plate, a deformation connecting device, a first probe, a second probe, a circuit board and a first welding pad are solved in sequence.

Description

technical field [0001] The invention relates to a method for assembling, repairing and testing parameter setting of a vertical probe card device, which relates to the technical field of probe cards. Background technique [0002] The generation of a chip mainly needs to go through four major links: design, manufacturing, packaging, and testing. After the wafer manufacturing is completed, it is necessary to test the freshly released wafer. In this link, the electrical performance of each chip will be tested. , wafer inspection has two main purposes: [0003] First, identify qualified chips to enter the packaging process, saving unnecessary packaging costs; [0004] Second, evaluate the electrical parameters of the circuit to maintain the quality level of the process. [0005] A very important consumable in wafer testing - probe card, probe card is mainly used in wafer testing, it is the medium between wafer and electronic testing system in wafer testing, engineering verifica...

AI Technical Summary

Problems solved by technology

[0012] Flatness is the vertical distance between the highest and lowest points of the probe pin on the probe card, which defines the first time the probe tip The vertical displacement from the electrical contact to the last electrical contact. During the assembly process of the probe, the flatness problem exists, but the maximum flatness is required not to exceed 25mm. The flatness is rarely concerned, but it directly affects the contact with the probe. The contact of the solder pad directly or indirectly affects key test variables such as contact pressure, contact resistance and clarity of needle marks, how to overcome the problem of poor contact caused by flatness

[0013]Third, the repair and assembly of the probe

[0014] As an important consumable in wafer testing, changes in the physical shape of the probe tip will directly affect the test results, and may damage the test device, a large number of probes The needle tip of the medium probe is physically deformed or a large amount of extrusion causes the probe to bend sideways, and the next detection cannot be performed, but only a few cannot continue to detect, and most of the probes can still continue to work. The replaced probe card is due to repair , The assembly and replacement procedures are cumbersome and can only be scrapped, resulting in waste of resources

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