Vertical probe card device and detection method thereof

A probe card and probe technology, which is applied in the direction of measuring devices, measuring electricity, measuring electrical variables, etc., can solve problems such as deformation offset and probe contact problems, and achieve improved service life, good contact, and clear needle marks. Effect

Active Publication Date: 2022-02-11
FTDEVICE TECH (SUZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] The present invention overcomes the deficiencies of the above-mentioned prior art, and provides a vertical probe card device and its detection method, which are used to solve the existing deformation and offset problems, probe contact problems and probe replacement and repair problems

Method used

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  • Vertical probe card device and detection method thereof
  • Vertical probe card device and detection method thereof
  • Vertical probe card device and detection method thereof

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Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0052] This embodiment is an embodiment of a vertical probe card device.

[0053] like Figure 1-10 As shown, a vertical probe card device disclosed in the present embodiment, includes a upper layer guide plate 1, a middle guide plate 2, a lower guide plate 3, a deformed connection device 4, a first probe 5, a second probe 6, a circuit board 7, First pad 8; the upper guide plate 1, the middle guide plate 2 and the lower guide plate 3 respectively correspond to a plurality of vertical limit via, and the upper layer guide plate 1 and the middle guide plate 2 are disposed with a plurality of deformed connecting devices. 4, one end of the plurality of the first probe 5 is electrically connected to the vertical limit vias of the upper guide plate 1 and the corresponding set of deformation connecting means 4, and the other end and the corresponding first solder on the circuit board 7 The pad 8 is connected, and one end of the plurality of the second probe 6 passes through the vertical li...

specific Embodiment approach 2

[0086] This embodiment is an embodiment of a vertical probe card device.

[0087] The test parameter setting method of a vertical probe card device disclosed in this embodiment includes the following steps:

[0088] Step A, assume the length,

[0089] First assemble some vertical probe card devices to be trial, during the assembly process, the length of the elastic needle 4-7 is disposed on the side wall of the stabilizer 4-4 during assembly, and the elastic needle 4-7 is effective length. The effective length of the elastic needle 4-7 is initially set to S, and then assemble a vertical probe card device;

[0090] Step b, flat test

[0091] The vertical probe card of the assembled to be experiment will be mounted on the carrier of the test probe station, and the contact flat test is performed one by one, and the highest point and the lowest point of the second probe 6 tip of the vertical probe card are measured. The distance between the second probe 6 tip of the second probe 6 is ...

specific Embodiment approach 3

[0112] This embodiment is an embodiment of a vertical probe card device.

[0113] A vertical probe card device probe displacement amount calculation method, including the following steps:

[0114] Step A. The material elastic modulus E and the inertial moment I of the elastic needle 4-7 are measured;

[0115] Step b, the force analysis calculates the concentration member 4-1 acts on the concentrated load of one end of the elastic needle 4-3 by the limit bead 4-3, and when the number of elastic needles is N, calculate the elastic needle 4 -7 Limit bead 4-3 concentration load is

[0116] Step C. Draw a centralized load The role is in the limit beads 4-3, the moment of the elastic needle 4-7, that is, M P picture;

[0117] Step D, plot the unit load The role is in the limit beads 4-3, the moment of the elastic needle 4-7, that is, M 1 picture;

[0118] Step e, calculate the longitudinal displacement of the limit bead 4-3 according to the multiplication

[0119] Among them: the pr...

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Abstract

The invention discloses a vertical probe card device and a detection method thereof, and relates to the technical field of probe cards. The vertical probe card device comprises an upper-layer guide plate, a middle-layer guide plate, a lower-layer guide plate, deformation connecting devices, a first probe, a second probe, a circuit board and a first welding pad. The upper-layer guide plate, the middle-layer guide plate and the lower-layer guide plate are respectively and correspondingly provided with a plurality of vertical limiting through holes, a plurality of deformation connecting devices are arranged between the upper-layer guide plate and the middle-layer guide plate in an array mode, and one end of each of the first probes penetrates through the vertical limiting through hole of the upper-layer guide plate to be electrically connected with one end of each of the correspondingly-arranged deformation connecting devices; the detection method of the vertical probe card device sequentially comprises the steps of fixed installation, alignment and positioning, height setting, pressure boosting and closed circuit testing. According to the vertical probe card device and the detection method thereof, the problems of deformation and deviation of the existing probe, contact of the probe and replacement and repair of the probe are solved, so that the effects of good contact, clear probe marks and effective utilization are achieved.

Description

Technical field [0001] A vertical probe card apparatus and detection method thereof involves the technical field of probe card. Background technique [0002] The generation of a chip mainly needs to undergo design, manufacturing, packaging, test four links, and then test the freshly released wafer after the wafer manufacturing is completed. In this link, the electrical energy of each chip will be detected. There are two main purposes in wafer detection: [0003] First, identify qualified chips into the package process, save unnecessary packages; [0004] Second, the electrical parameters of the circuit are evaluated to maintain the quality level of the process. [0005] A very important consumables in the wafer test - probe card, the probe card is mainly used in the wafer test link, which is the medium between wafer and electronic test system in wafer test, and before the chip mass production. The link will also be tested by a probe card. During the test of the probe card, the pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/067G01R1/073
CPCG01R1/067G01R1/073
Inventor 王强金永斌贺涛丁宁朱伟
Owner FTDEVICE TECH (SUZHOU) CO LTD
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