[0051] Next, the technical solutions in the embodiments of the present invention will be described in connection with the drawings of the embodiments of the present invention, and it is understood that the described embodiments are merely the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art are in the range of the present invention without making creative labor premise.
[0052] Please refer to figure 1 , figure 1 Method flow chart of a specific embodiment provided by the present invention.
[0053] In a specific embodiment of the present invention, the tin optimized welding method is mainly included in the insertion part, respectively, respectively, respectively:
[0054] S1, get the aperture and position information of all mounting through holes on the currently processed board PCB, and the pin diameter of the respective straight-in parts corresponding to each mounting through hole;
[0055] S2, calculate the difference between each other between the pore diameters and the pin diameter, and screen out position information of the installation through hole corresponding to the portion of the difference greater than the preset threshold;
[0056] S3, the straight-in-in-component parts are inserted toward the corresponding mounting through holes in the corresponding.
[0057] S4, according to the position information, the voids between the corresponding mounting through holes and the pins of the insertion part are plugged into a filling member 7; wherein the filling member 7 has several components 7 for flowing the solder. Confucius 9;
[0058] S5, the panel PCB performs wave welding treatment.
[0059] Among them, in step S1, the aperture (inner diameter) and location information of all mounting through holes on the currently processed board PCB are first obtained, while acquiring pin diameter information of each inserted part corresponding to each mounting through hole.
[0060] Specifically, in this step, GERBER files are generally configured in the production system (such as ERP system, etc.) of the board PCB, and the Gerber file is mainly used to update and store the current board PCB production process. All parts information and board PCB structures are used, where part information mainly includes information such as the position, number of insertion parts, and the structural information of the board PCB mainly includes all the apertures, positions of the installed through holes and the remaining VIA holes. And other information, so, by calling the gerber file, the aperture and location information of all mounting through holes are downloaded from it.
[0061] In the same way, considering that the direct-in-in-line parts are first needed before entering the production system, it first needs to be bracketd by the number application system. Therefore, in this step, the material is applied to the material (such as a PLM system, etc.) When the number of the integral specifications and overall size information of the insertion part, the pin diameter of the pins of the insertion part can be added to the information number application system. Then, when the production system is accessed, the updated board BOM (Material List) can be imported into the production system, which can be extended to export the pin diameter information of all in-board parts in the board BOM. .
[0062] In step S2, each group has a unique corresponding aperture and pin diameter data in each group, in this step, first calculate the difference between the apertures and pin diameters in each of the group data. Value, then compare each difference with the preset threshold, and filter out part of the differences greater than the preset threshold value, and match the position information of each mounting through hole corresponding to the partial difference.
[0063] Specifically, in this step, the Gerber file can be automatically aligned in the production system in the production system in this step to filter the pore diameter of the mounting through hole 0.4 ~ 0.6mm (such as 0.5 mm) is inserted, and then the mounting through which this part of the insertion part is positioned on the board PCB on the board PCB according to the gerber file.
[0064] In step S3, the main content is to separate the respective inserted parts along the forward direction (generally from the surface of the board PCB) to each board PCB.
[0065] In step S4, the primary content is the position information of the mounting through hole according to the second step, in which the inner wall of the inner wall and the lead-in member of the inner wall and the insertion part are inversely The direction (generally a bottom surface of the board PCB) is plugged into the fill member 7 to fill the above environment voids by the filling member 7, and the fill member 7 has electrical conductivity, and it is possible to adequate pins and mounting through holes. conductor. At the same time, there is also a plurality of holes 9 on the fill member 7, and the liquid solder can be smoothly circulated when the waveform welding process is performed.
[0066] In an alternative embodiment with respect to step S4, a sleeve having a conductive can be plugged in the mounting through hole. The sleeve has a ring shape, has a wall thickness, and its wall thickness and the outer diameter of the inner diameter of each mounting through hole are equivalent, that is, the inner diameter and pin of the sleeve. The outer diameter is the same, and the outer diameter of the sleeve is the same as the inner diameter of the mounting through hole, so that the sleeve is inserted into the slit between the pin and the mounting through hole. Further, there is a plurality of holes 9 in the sleeve, and each of the holes 9 extends axially and radially so that liquid solder flows along the hole 9. Of course, each hole 9 must penetrate the bottom end surface of the sleeve and the tip end surface, a circumferential surface. As such, when the wave welding treatment is performed, the liquid solder will crawl flow in each of the holes 9 in the sleeve, thereby filing the gap between the attachment through holes and the pins.
[0067] like image 3 , Figure 4 Distance image 3 A specific structure of the filling member 7, Figure 4 The structural diagram of the filling member 7 is supported by the metal flap 8 in the mounting through hole.
[0068] In another alternative embodiment regarding step S4, the elastic metal sleeve in which the seam is left in the circumferential direction can be stuffed in the mounting through hole. The elastic metal sleeve has a thin thickness, which can make a circumferential elasticity, thus curring it to the wrap pin, and secure the pin. At the same time, a multi-layer metal flap 8 is also covered on the circumferential surface of the elastic metal sleeve, and each layer of metal flaps 8 can be deployed to a horizontal state (radial) and card dead, and the unfolded length of the metal flaps 8 of each layer is The radial distance between the inner wall of the mounting through hole is equivalent, thereby opening the inner wall of the mounting through holes after the metal flaps 8 is deployed. Further, a hole 9 is also opened on each of the metal flaps 8 so that liquid solder flows along the hole 9. As such, when the wave welding treatment is performed, the liquid solder flows upwardly through the holes 9 on each of the metal flaps 8, thereby filing the gap between the mounting hole and the pin.
[0069] In step S5, the main content is a wave welding process for the plate PCB, and the peak solder welding process between the direct-in-in-shaped parts and the mounting through hole is completed.
[0070] As such, the insertion part provided in this example is optimized the welding method. Since the povert member 7 is first mounted by the plurality of holes, the portion is packed, and the portion mounting through hole is first. The annular voids between the pins of the insertion part are filled, and there is also a hole 9 on the filling member 7, and therefore, in the process of performing wave welding treatment, the liquid solder can smoothly along the various holes of the filling member 7. The mounting through hole and the pin are reptled and the hole 9 of the entire fill member 7 and the space between the attachment and the pin are mounted, and the conductivity of the filling member 7 itself is used as part of the solder, ensuring the mounting through hole and Steady electrical connection between the pin.
[0071] Compared to prior art, this embodiment can improve the upper tin amount of insertion parts in the wave welding process, preventing the quality problem of welding poor welding, and avoids post-artificial repair work.
[0072] Further, in consideration of the number of mounting through holes and insertion parts, in order to increase the filling operation efficiency of the fill member 7, the step S3 is added to step S3 and step S4.
[0073] Specifically, the reverse insertion plate 10 is first made according to the shape of the currently processed board PCB. In general, the plane shape of the reverse insertion flat plate 10, the size is consistent with the planar shape of the plate PCB, such as the plate PCB in a torque shape, and the reverse insertion plate 10 also has a torque shape, and the board card The length of the PCB, the width size is the same as the reverse insertion flat plate 10, and the thickness of the reverse insertion plate 10 can be different from the board PCB.
[0074] like Figure 5 Distance Figure 5 A specific structure diagram of the reverse insertion plate 10.
[0075] Second, the reverse insertion hole 11 is opened at the corresponding position on the surface of the reverse insertion flat plate 10 according to the position information selected in step S2. That is, the respective reverse dowry hole 11 is the same as the distribution of the mounting through holes in the board card PCB in the reverse insertion flat sheet 10.
[0076] The corresponding fill member 7 is then installed in each reverse insertion hole 11. In general, each of the plug members 7 can be directed in each reverse insertion hole 11, in order to be able to move along the axial direction of the reverse dosing hole 11.
[0077] Finally, the bottom surface of the board PCB is on the surface of the reverse inserted flat plate 10 and the plate PCB is covered on the surface of the reverse insertion plate 10. In this setting, the various screens on the board PCB can be aligned with the reverse insertion hole 11 on the reverse insertion plate 10, respectively, in communication, and corresponding mounting through holes and corresponding The gap between the pins of the insertion part is aligned with the filling member 7 mounted in each reverse insertion hole 11 to perform subsequent step S4.
[0078] Further, in step S4, it is possible to simultaneously plug into the corresponding mounting through hole by a plurality of robotic arms, respectively, such that each of the filling member 7 is simultaneously sliding into each In the gap between the attached through holes and the pins, a filling operation of each mounting through hole is implemented.
[0079] like figure 2 Distance figure 2 A system configuration diagram of a specific embodiment provided by the present invention.
[0080] This embodiment also provides a direct-in-in-in-in-in-component tin optimized welding system, mainly including information acquisition module 1, a difference filter module 2, a partial cartridge 3, a reverse filling mechanism 4, and a welding treatment mechanism 5.
[0081] Wherein, the information acquisition module 1 is primarily used to obtain all the apertures and position information of all mounting through holes on the currently processed board PCB, and the pin diameter of each straight-in-component corresponding to each mounting through hole. The difference screening module 2 is primarily used to calculate the difference between the corresponding pore diameter and the pin diameter, and screen out position information of the installation through hole corresponding to the portion of the difference greater than the preset threshold. The partial plug-in mechanism 3 is mainly used to separate each of the insertions into the corresponding mounting through holes respectively. The reverse pad mechanism 4 is mainly used in the reverse plugging member 7 in the reverse plug in the void between the corresponding mounting through holes and the pins of the insertion part; wherein the filling member 7 has several A hole 9 for flowing solder flows. The welding treatment mechanism 5 is mainly used to wave welding treatment on the plate PCB.
[0082] Further, in the present embodiment, the filling preloading mechanism 6 is also added, mainly used to make the reverse insertion flat plate 10 according to the shape of the currently processed board PCB, and open the reverse insertion in the reverse insertion plate 10 according to position information. The holes 11 are mounted in each reverse insertion hole 11, and the bottom surface of the plate PCB is covered with the surface of the reverse insertion plate 10.
[0083] The above description of the disclosed embodiments will be made to those skilled in the art or those skilled in the art can be implemented or used. A variety of modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Accordingly, the present invention will not be limited to the embodiments shown herein, but rather consider the broadest range consistent with the principles and novel features disclosed herein.
