Automatic high-speed packaging line for machining air inlet temperature and pressure sensor

Abstract

The invention discloses an automatic high-speed packaging line for machining an air inlet temperature pressure sensor, and particularly relates to the technical field of pressure sensor machining. The automatic high-speed packaging line comprises a packaging line body, the lower surface of the packaging line body is fixedly connected with the upper surface of a bottom plate, the upper surface of the bottom plate is fixedly connected with the lower surface of a positioning vertical plate, and a guide sliding groove is formed in the upper surface of the positioning vertical plate. By arranging an atomization discharger, a first guide pipe and a second moisture-proof plate, it is guaranteed that the packaging wire body is prevented from making direct contact with water mist while the indoor humidity of the packaging wire is improved, the situation that the packaging wire body is short-circuited due to excessive wetting is reduced, and open fire is not prone to being generated when metal in the packaging wire body collides, so as to improve the installation performance of the packaging wire in use, so that the packaging wire body can be ensured to be in a processing state for a long time, and the requirements of processing the pressure sensor by the existing packaging wire are met.

Description

technical field [0001] The invention relates to the technical field of pressure sensor processing, more specifically, the invention relates to an automatic high-speed packaging line for processing an intake air temperature and pressure sensor. Background technique [0002] The pressure sensor senses the pressure signal through the pressure sensitive unit, and converts the pressure signal into an available output electrical signal according to certain rules, and then the signal processing unit processes the electrical signal into the corresponding analog output or digital output form. [0003] Chinese patent literature (CN113582127A) discloses a pressure sensor packaging mechanism, which proposes in the specification that "pressure sensors are a type of sensors that are widely used, and such sensors are usually used to sense pressure or pressure signals. With micro-electromechanical systems With the development of technology, the manufacture of pressure sensors has become a r...

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Problems solved by technology

The metal soft wire is easy to break during packaging, resulting in a decrease in the yield of the pressure sensor." At the same time, it is proposed that "the chip electrodes of the pressure sensor chip are electrically redistributed through the redistribution layer and then connected to the external electrodes through conductive connectors, so as to avoid the direct contact of the chip electrodes. Connecting to the external electrodes through metal flexible wires and other structures further avoids the hidden danger of metal flexible wires breaking and improves the reliability of the pressure sensor packaging structure. However, in actual operation and application, it cannot completely solve the problem of pressure sensor production packaging The line room is too dry and prone to static electricity. Therefore, in the device described in the existing pressure sensor production and packaging line and the

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