Wafer bearing box

Abstract

The invention discloses a wafer bearing box. The wafer bearing box comprises a bearing frame, the bearing frame comprises clamping arms, the clamping arms comprise a first clamping arm and a second clamping arm which are arranged at intervals in the horizontal direction, a clamping space is defined between the first clamping arm and the second clamping arm, a silicon wafer is suitable for being placed in the clamping space, and the first clamping arm and the second clamping arm abut against the surfaces of the two sides of the silicon wafer in the thickness direction. According to the wafer bearing box, the first clamping arm and the second clamping arm are arranged at intervals in the horizontal direction, and the first clamping arm and the second clamping arm abut against the surfaces of the two sides of the silicon wafer in the thickness direction, so that the edge of the silicon wafer does not make contact with the bearing frame, and the situation that the corrosion cleaning degrees of the edge of the silicon wafer are different is avoided, therefore, the peripheral morphology of the edge of the silicon wafer is uniform, and damage caused by contact between the edge of the silicon wafer and the bearing frame is avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a carrying sheet box. Background technique [0002] It is pointed out in related technologies that after slicing silicon wafers, pollution, surface damage, and glossiness do not meet the requirements, etc., which affect product quality. It needs to be etched and cleaned, and the silicon wafers placed in the silicon wafer box for etching and cleaning cannot ensure that the surrounding morphology of the silicon wafers is uniform and the thickness is the same. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art. For this reason, the present invention is to provide a carrying sheet box, the carrying sheet box has a simple structure, which is beneficial to the uniform appearance of the surrounding area during silicon wafer etching and cleaning. [0004] According to the carrier film box of t...

AI Technical Summary

Problems solved by technology

[0002] It is pointed out in related technologies that pollution, surface damage, and glossiness do not meet the requirements after silicon wafer slicing, which will affect product quality.

It needs to be etched and cleaned, and the silicon wafers placed in the silicon wafer box for etching and cleaning cannot ensure that the surrounding morphology of the silicon wafers is uniform and the thickness is the same

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