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Flip LED chip, LED packaging module and display device

A LED chip, flip chip technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as affecting the luminous efficiency of the chip, and achieve the effect of avoiding the rupture of the insulating layer

Active Publication Date: 2022-02-18
XIAMEN SANAN OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the metal block placed in the groove area will absorb the light emitted by the chip, affecting the luminous efficiency of the chip

Method used

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  • Flip LED chip, LED packaging module and display device
  • Flip LED chip, LED packaging module and display device
  • Flip LED chip, LED packaging module and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] This embodiment provides a flip-chip LED chip, and the flip-chip LED chip can be a small serial light-emitting diode chip (LED chip) with a smaller horizontal area.

[0076] The flip-chip LED chip includes a substrate, three light-emitting units and bridging electrodes; the surface of the substrate includes a first side and a second side perpendicular to each other, and the length of the first side is greater than or equal to the length of the second side; the three light-emitting units The units are arranged on the substrate at intervals, the three light emitting units include a first light emitting unit, a second light emitting unit and a third light emitting unit, and the first light emitting unit, the second light emitting unit and the third light emitting unit are arranged along the first light emitting unit on the surface of the substrate. The extension directions of the sides are arranged in sequence. Each light emitting unit includes a first semiconductor layer,...

Embodiment 2

[0106] This embodiment provides a flip-chip LED chip. The flip-chip LED chip is similar to the flip-chip LED chip in Embodiment 1, which will not be repeated here. The difference lies in:

[0107] refer to Figure 5 , in this embodiment, the bridge electrode 800 connecting the first light-emitting unit 201 and the second light-emitting unit 202, or the bridge electrode 800 connecting the second light-emitting unit 202 and the third light-emitting unit 203 includes a first sub-bridge electrode 810 and the second sub-bridge electrode 820 . The first portion 801 of the first sub-bridge electrode 810 is not connected to the first portion 801 of the second sub-bridge electrode 820 , and the second portion 803 of the first sub-bridge electrode 810 is not connected to the second portion 803 of the second sub-bridge electrode 820 .

[0108] Thus, the first sub-bridge electrode 810 and the second sub-bridge electrode 820 are formed as two independent bridge electrodes, and the two ind...

Embodiment 3

[0110] This embodiment provides a method for preparing the flip-chip LED chip described in Implementation 1 or 2, including:

[0111] S101: Provide a rectangular substrate, the surface of the substrate includes a first side and a second side perpendicular to each other;

[0112] refer to figure 1 , providing a substrate 100 , the substrate 100 includes but not limited to a sapphire substrate 100 , a GaAs substrate 100 , a GaN substrate 100 , and a SiC substrate 100 . In this embodiment, the sapphire substrate 100 is taken as an example for illustration.

[0113] S102: Form three light-emitting units spaced apart from each other on the substrate, the three light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, and the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit Arranged in sequence along the extension direction of the first side of the substrate surface; each lig...

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Abstract

The invention discloses a flip LED chip, an LED packaging module and a display device. In the flip LED chip, the surface of a substrate comprises a first edge and a second edge which are perpendicular to each other; the three light-emitting units are arranged on the substrate at intervals, and the first light-emitting unit, the second light-emitting unit and the third light-emitting unit are sequentially arranged in the extending direction of the first edge of the surface of the substrate. The bridging electrodes are arranged on the two adjacent light-emitting units and between the adjacent light-emitting units and are connected in series with the adjacent light-emitting units; the longitudinal projection of the second light-emitting unit on the substrate comprises a first edge and a second edge which are perpendicular to each other, the first edge is correspondingly parallel to the second edge of the substrate, the length of the first edge is larger than that of the second edge, the surface of the second light-emitting unit comprises an ejector pin acting area, and the length of the second edge is larger than or equal to the diameter of the ejector pin acting area. The acting force of the ejector pin can be distributed on the surface of the second light-emitting unit, and the problem that an insulating layer on the surface of a chip is broken due to overlarge local stress is solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor devices, in particular to a flip-chip LED chip, an LED package module and a display device. Background technique [0002] LED (Light Emitting Diode) has the advantages of low cost, high luminous efficiency, energy saving and environmental protection, etc., and is widely used in lighting, visible light communication and light-emitting display and other scenarios. [0003] One of the development directions of LED is to develop towards miniaturization and miniaturization. After LED is shrunk, it forms an array with millimeter or even μm spacing, which can achieve ultra-high resolution, so that it can be more widely used in information display and other fields. [0004] At present, small-sized flip-chip LED chips have been widely used in backlight display and RGB display devices, and the current display products on the market are all based on thousands or tens of thousands of flip-chip LED chips...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/08H01L33/38H01L33/14H01L33/20H01L25/075
CPCH01L33/08H01L33/387H01L33/145H01L33/20H01L25/0753Y02B20/30H01L27/156H01L33/385H01L33/62
Inventor 刘士伟徐瑾石保军王水杰刘可陈大钟张中英
Owner XIAMEN SANAN OPTOELECTRONICS CO LTD