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Wiring circuit board and method for manufacturing wiring circuit board

A technology for wiring circuit substrates and manufacturing methods, which is applied in the directions of circuit substrate materials, printed circuit manufacturing, and metal adhesion improvement of insulating substrates, can solve problems such as the height difference of covering insulating layers, achieve efficient manufacturing, ensure reworkability, The effect of improving adhesion

Pending Publication Date: 2022-02-18
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Here, the cover insulating layer has a height difference because it covers the conductive pattern, while the mounting surface of the base insulating layer is relatively flat without the conductive pattern and the cover insulating layer.

Method used

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  • Wiring circuit board and method for manufacturing wiring circuit board
  • Wiring circuit board and method for manufacturing wiring circuit board
  • Wiring circuit board and method for manufacturing wiring circuit board

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Embodiment

[0134] The present invention will be further specifically described below by showing reference examples and reference comparative examples. In addition, this invention is not limited to a reference example and a reference comparative example. In addition, specific numerical values ​​such as compounding ratios (content ratios), physical property values, and parameters used in the following descriptions may be replaced by their corresponding compounding ratios (content ratios), physical property values, and parameters described in the above "Detailed Embodiments" The upper limit (value defined in the form of "below" and "less than") or the lower limit (value defined in the form of "above" and "exceed") of related records.

[0135] Reference Comparative Example 1

[0136] Prepare the metal support body that is material with stainless steel, polyimide precursor solution is coated on the upper surface of metal support body, then make it dry 10 minutes at 80 ℃, form basic film (pol...

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Abstract

The present invention comprises, on a mount board 1, a base insulating layer 4 that contains polyimide and a first terminal 10 that is disposed on one surface 4A of the base insulating layer 4 in the thickness direction. The amount of metal element detection by ESCA measurement on the one surface 4A of the base insulating layer 4 in the thickness direction among all detected elements is adjusted to 1 atom% or more and less than 20 atom%.

Description

technical field [0001] The present invention relates to a wired circuit board and a method for manufacturing a wired circuit board. Background technique [0002] Conventionally, a wired circuit board on which electronic components such as image sensors are mounted is known. [0003] For example, an image sensor mounting substrate is proposed, which sequentially includes: a base insulating layer having an image sensor opening, a conductor pattern having an image sensor connection terminal, and a cover insulating layer, the image sensor connection terminal being exposed from the image sensor opening, It is arranged so as to be flush with the surface of the base insulating layer on the opposite side to the cover insulating layer (for example, see Patent Document 1). [0004] Such an image sensor mounting substrate can be manufactured by forming a basic insulating layer on a metal support, forming a conductive pattern on the basic insulating layer and the metal support exposed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38
CPCH05K3/18H05K1/03H05K3/38
Inventor 笹冈良介福岛理人桑山裕纪
Owner NITTO DENKO CORP