Microelectronic packaging assembly tray transfer mechanism between high-vacuum sealed cavities

Abstract

The invention discloses a microelectronic packaging assembly tray transfer mechanism between high-vacuum sealed cavities, and solves the problem of how to complete tray transfer by adopting a simple and economical driving mechanism in a limited space. A gate valve is arranged between two high vacuum chambers for microelectronic packaging assembly tray transfer, a transfer mechanism is arranged in a second activated process chamber, and a driving motor of the transfer mechanism is arranged outside the process chamber, so that the independent sealing performance of the process chamber is ensured, and meanwhile, the stable and reliable movement of the tray is realized due to good guidance; compared with a vacuum motor, the driving motor reducer adopts a common motor, so that the cost is reduced and the service life is prolonged; besides, the length of a mechanical arm is shortened, the intermittent segmented conveying of the trays is achieved through reciprocating work of the mechanical arm, and the purpose of reducing the occupied space of the tray transferring mechanism is achieved; the process cavity is independent, the transfer of the high-vacuum trays is achieved, and the driving structure is simple, economical, reliable and durable.

Description

technical field [0001] The invention relates to a microelectronic packaging device, in particular to a transfer mechanism and a transfer method for completing trays of microelectronic packaging components between high-vacuum multi-chambers. Background technique [0002] Microelectronic packaging and assembly (MEMS devices), that is, using film technology and micro-processing technology to arrange, paste, fix and connect chips and other elements on the frame or substrate, lead out the connection terminals, and potting and fixing them through plastic insulating media. Then, according to the electrical schematic diagram or logic diagram, microelectronics technology and high-density assembly technology are used to assemble microelectronic devices and micro-miniature components into applicable and producible electronic components, components or a technical process of a system; currently, vacuum packaging equipment It is changing from a single machine to a multi-chamber capable of...

AI Technical Summary

Problems solved by technology

[0003] The invention provides a tray transfer mechanism for microelectronic packaging components between high-vacuum airtight chambers, which solves the technical problem of how to use a simple and economical drive mechanism to complete tray transfer in a limited space

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